
Samsung’s process technology improvement brings significant benefits for performance and power consumption
• The company aims to release chips made by SF1.4 technology in 2027,which is 1.4nm-class and will gain nanosheets from three to four.
• Mechanism of increasing nanosheets per transistor:
1.enhancement of driving current→improving chip performance
Negotiations between Kioxia and Western Digital terminated due to Hynix’s opposition
• WDC exited the talks with Kioxia after losing approval from Hynix, as the latter is indirect shareholder in Kioxia.
• The combined market share of these two firms for NAND memories stood at 35.4% as of Mar.,23, larger Samsung which accounted for 34.3%.
• The two companies are expected to continue partnering on chip development and plants investment despite existing status.

SK Hynix endeavors consolidating its position in future AI infrastructure
• The company recorded a 24% revenue growth and 38% operating losses narrowed compared with 2FQ23 thanks to strong demand for high-performance mobile flagship products and HBM3, a key product for AI applications, and high-capacity DDR5.
• Hynix plans to increase investments in HBM, DDR5 and LPDDR5. It will also increase the share of the products manufactured from the 1anm and 1bnm, the 4th and the 5th generations of the 10nm process.

Micron initiates construction on memory manufacturing fab
• The factory is located in Boise, home to Micron’s corporate HQs and the only DRAM R&D fabrication facility in North America.
• Co-locating the memory manufacturing fab is expected to provide multiple strategic benefits for Micron and the US semiconductor industry at large as Micron continues to drive industry leadership.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Signage Storage 涵蓋 Digital Signage、POS、Kiosk 與 AI 零售設備的本機儲存需求。本文解析 SSD 介面、容量、耐寫度、工作溫度、PLP、SMART 監控與固定 BOM 等選型重點。

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

醫療設備正在快速數位化。從實務上來看,醫學影像、病患監測、內視鏡系統、自動調劑櫃,到醫療邊緣閘道器,越來越多設備負責執行檢查或治療流程也同時需要即時記錄影像、感測數據、操作紀錄、警報事件與系統狀態。 對醫療設備製造商來說,儲存裝置已經從容量規格的一部分,升級為影響資料完整性、設備穩定性與產品生命週期的重要元件。
