Samsung delays mass production at its Texas fab
• The company scales back its Texas operation due to uncertain CHIPS Act subsidies and the global economy.
• The CHIPS and Science Act, which is supposed to be provided to semiconductor companies to encourage the construction of foundries in the U.S., is still largely in the pipeline, with just $35 million of the total $52 billion granted so far.
WD’s board of directors approved a plan to separate its HDD and flash businesses
*Facts about PCIe 5.0: developed by PCI-SIG, up to 14,000 MB/s read, enables twice the data transfer speed and bandwidth versus the PCIe 4.0 spec
• Kioxia CM7 and CD8P series drives can now be found on the PCI-SIG Integrator’s List
SK hynix's market share of the DRAM market has reached 35% as of Q3’23
• This is the most notable growth among manufacturers, reaching $4.626 billion and significantly narrowing the firm’s market share gap with Samsung to less than 5%.
• The firm benefited from growth in HBM and DDR5 shipments and is expecting a steady quarterly rise in 2024 in line with DDR5’s growing market penetration.
Recent Micron strategies in China is considered as moves to make amends with the Chinese authorities
*Background: Chinese government’s prohibition against Micron chips in the nation's critical infrastructure affects its business significantly
• The firm reached a global settlement concerning a seven-year-old intellectual property theft lawsuit against Chinese state-owned Jinhua Integrated Circuit Co.
• Micron promised to invest another 4.3 billion yuan (US$ 606.2 million) in its chip-making plants in China.
Q4 demand is at the highest level of 2023.
NAND Sufficiency: maintained at extreme low level from 2H23 to 2024
Price Trend: NAND Flash price is likely to climb continuously during 1H24, after a sharp rise in 4Q23
DRAM Sufficiency: maintained at extreme low level starting from Q423
Price Trend: 8Gb contract price overlapped the spot low level in Dec.’24., and will climb up slowly in 1H24
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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