Samsung and SK hynix showcased their upcoming GDDR7 memory solutions at NVIDIA GTC 2024
• Both displayed 16Gb (2GB) devices while JEDEC GDDR7 standard is finalizing. The chips would have been produced prior to the official standard and this has some implications for the next generation Nvidia Blackwell and AMD RDNA 4 GPUs.
Kioxia and WD Elevate Capacity Utilization to nearly 90%
• This is in hopes of returning to profitability with anticipation of NAND flash price hikes into 2Q24.
Kioxia sets sight on 218-layer capacity expansion by 2025 to lead in high-stack technology.
Process upgrades are essential for maintaining cost competitiveness with NAND flash prices are on the rise in 2024 amidst a gradual reduction in suppliers’ stock levels.
Kioxia’s strategy involves directly advancing to 300-layer and above processes after 218 layers to achieve a more favorable cost structure and regain technological and cost leadership.
Micron announced its fiscal 2Q24 financial results (ended Feb.’24)
• Revenue portion: DRAM:NAND=71%:29%
• The company expects to maintain its technology leadership in NAND. AI server demand is driving rapid growth in HBM, DDR5 and data center SSDs, which is tightening leading-edge supply availability for DRAM and NAND.
WW SSD demand is expected to grow stably throughout 2024.
NAND Sufficiency: maintained at a low level since 2H23
Price Trend: NAND flash price is expected to climb continuously at least until 3Q24
DRAM Sufficiency: maintained at an extreme low level during 1Q-3Q24
Price Trend: 8Gb contract price increased obviously in Jan.’24. and will remain higher than the spot low trend in 2024
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▲ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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