Samsung's foundry customers reportedly flock to TSMC
• South Korean developers of AI processors that used to make chips at Samsung Foundry including DeepX, FuriosaAI, and Mobilint, are turning to TSMC to diversify their supply. This helps pricing negotiation and is a failsafe if one of the chips fails to become successful.
Nanya to develop vertical channel transistor DRAM technology with Kioxia
• This innovation focuses on reducing power consumption and achieving extremely low leakage current by using oxide semiconductors, enhancing circuit integration by improving the manufacturing process.
• The collaboration reflects efforts of the 2 firms to meet the increasing demand for energy efficiency and performance in high-density applications, including AI-driven devices, post-5G communication, and IoT.
WD split between HDD and SSD products
• The firm intends to improve operational focus and create two independent, more agile companies-WesternDigital.com for all HDD and platform products and SanDisk.com for all flash products. The formal split was set to be completed in 2024 2H.
SK hynix begins volume production of 12-Layer 36GB HBM3E memory
• This 5th-gen HBM is so far the highest-performing and highest-capacity memory product, its chip is made 40% thinner than the 8-layer generation, which increases 12-layer chip’s capacity by 50%. Hynix plans to supply mass-produced products by 2024/E.
Micron Gen5 data center SSDs qualified for recommended vendor list on Nvidia GB200 NVL72 and its derivatives
• The 9550 NVMe SSD delivers world-class AI workload performance and power efficiency:(1) up to 34% higher throughput for Nvidia Magnum IO GPUDirect (2) up to 33% faster workload completion times in graph neural network training with Big Accelerator Memory (3) saves energy and sets new sustainability benchmarks by consuming 81% less SSD energy per 1TB transferred than other SSD offerings.
WW SSD demand is expected to reach a peak at the end of 2024, and 2025 general shipping status is likely to stay above 2024’s quarterly level
Flash Sufficiency: maintained at low level since 2024/B
Price Trend: NAND flash price is likely to drop during 4Q24-1Q25, yet some chip makers plan a new round of production cuts to reduce price drop extent
DRAM Sufficiency: maintained at extreme low level throughout 2024 but is likely to have more production in 1Q25 to fulfill HBM demands
Price Trend: 8Gb contract price had a strong bound at Q1/E’24, price maintained at similar level since then. In 2025, DRAM price may drop a bit but remains relatively high compared to lowest spot price level
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▂ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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