
SAMSUNG has decided to ramp up its wafer production capacities for memory and system semiconductors by around 10% in 2023. Its move is in sharp contrast to those of its rivals such as TSMC, Intel, Micron Technology, and SK Hynix, which all declared a reduction of their investments. SAMSUNG also decided to install more than 10 units of EUV lithography equipment for high-tech DRAM and foundry production. It currently has about 40 units of EUV equipment.
WDC has restarted talks with KIOXIA in a deal that could unite two technology storage providers, according to people familiar with the matter. The value of deals targeting semiconductor companies fell by more than a third last year to about $25 billion.


SK Hynix has set up a global strategy organization to respond to the rapidly changing global business environment and streamlined its internal decision-making system to increase the speed and flexibility of decision-making. It is planning to abolish its existing safety development and manufacturing and business organizations and speed up decision-making between the CEO and heads of major organizations.
Micron on Dec. 21 announced a host of cost-cutting measures, including a 10% workforce reduction, aimed at helping it weather a rapid drop in revenue. It said the worst industry glut in more than a decade would make it difficult to return to profitability next year. Micron also projected a steep sales decline and a wider loss than analysts had estimated for the current quarter.

W.W. SSD Shipment: Worldwide SSD shipment is expected to grow gradually.
NAND Sufficiency: NAND Flash expected to maintain oversupply globally in the overall picture.
Price Trend: NAND Flash price trend is expected to be flat in Q1 and dip slightly lower in Q2 and Q3.
DRAM Sufficiency:Global demand is weak, so oversupply is expected to last until 2023/Q3.
Price Trend:Contract price is expected to trend lower in Q1 but rate of decline will be slower YoY.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage supports the local storage requirements of Digital Signage, POS, kiosks, and AI retail systems. Explore key SSD selection factors, including interface, capacity, endurance, operating temperature, PLP, S.M.A.R.T. monitoring, and fixed BOM.

Erfahren Sie, wie TBW, DWPD, P/E-Zyklen und pSLC, MLC, TLC, und QLC die Lebensdauer industrieller SSDs beeinflussen. Wählen Sie die richtige SSD für Überwachung, Cybersicherheit und Edge-Workloads mit Unterstützung von ADATA Industrial.

SSD-SMART-Daten bieten eine kontinuierliche Aufzeichnung des Betriebszustands eines Speichergerätes. Sie melden Informationen, wie akkumulierte Betriebsstunden, Temperatur, Schreibvolumen, Verbrauch der Lebensdauer, verfügbare Reservekapazität und unerwartete Stromausfallereignisse.

Erfahren Sie, wie Automobil-SSDs basierend auf AEC-Q100-Klassen, IATF 16949, ISO/SAE 21434, PLP und pSLC für fahrzeuginterne, Schienenverkehrs- und Edge-Systeme ausgewählt werden.