
AMD to use Samsung's 3nm tech as it looks to dual-source future chips
• The firm stated at ITF World 2024 that it will mass-produce chips on a 3-nm-class GAA process, and Samsung Foundry is the only company to offer such production technology.
• Using Samsung Foundry as 2nd source other than TSMC is considered AMD’s strategy to expand its manufacturing capacity, sell more products, and gain leverage for price negotiations with TSMC.
Kioxia showcased in Dell Technologies World product lineup designed to meet evolving IT demands of the future
• The company highlighted its PCIe 5.0 SSDs in the show, stressing the benefits over PCIe 4.0 SSDs in a variety of real-world server and storage configurations/workload combinations including CD8 U.2 for data center and CM7 E3.S enterprise NVMe SSDs.
Western Digital launched WW Highest Capacity 6TB 2.5-Inch HDDs
• The record-breaking HDD features 256-bit AES hardware encryption to achieve password protection.


SK Hynix working on products suitable for datacenter AI training, edge AI, and on-device AI inference
• Such products include 300TB SSD, HBM4, CXL Pooled Memory Solutions, LPDDR6, GDDR7, and high-capacity DDR5.
• The 300TB SSD is considered a rival for Samsung's PBSSD initiative which is limited to storing 240TB of data.
Micron speeds up to 5,600MT/s in 32Gb die-based 128G DDR5 R-DIMM on leading server platforms
• The DDR5 R-DIMM is based on 1β technology, which delivers more than 45% improved bit density, up to 22% improved energy efficiency, and up to 16% lower latency over competitive products with 3DS TSV packaging technology.
• Such an advanced product will be supported by ecosystems including AMD, HPE, Intel, and Supermicro.

WW SSD demand will not show obvious growth throughout 2024, yet is still recovering gradually.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▲ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

Erfahren Sie, was eine NVMe-SSD ist, wie sich NVMe von SATA-SSDs unterscheidet und warum NVMe-Speicher ideal für die Automatisierung, industrielle Systeme und die hochfrequente Datenprotokollierung ist.

Erfahren Sie, was ECC-DRAM ist, wie die Fehlerkorrektur funktioniert und warum sie für Datenintegrität, Systemstabilität, Netzwerksicherheit und geschäftskritisches Computing wichtig ist.

Hauptaspekte bei der Auswahl des NVR-Speichers: Vergleichen Sie für den Aufbau eines stabilen, leistungsstarken Überwachungssystems die Speicheranforderungen von Festplatte, SSD, Überwachungs-SSD und KI-NVR.