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THE 112-LAYER 3D NAND (BiCS5) 31C SERIES

THE 112-LAYER 3D NAND (BiCS5) 31C SERIES

THE 112-LAYER 3D NAND (BiCS5) 31C SERIES

PRODUCT SPECIFICATIONS

ISSS31C

2.5" SSD
  • Form Factor : 2.5”
  • Capacity : 128GB - 2TB
  • Interface : SATA III
  • Seq. Read (Max.) : 560MB/s
  • Seq. Write (Max.) : 500MB/s
  • Operating Voltage : 5V

IM2S31C8

M.2 2280 SSD
  • Form Factor : M.2 2280
  • Capacity : 128GB - 2TB
  • Interface : SATA III
  • Seq. Read (Max.) : 560MB/s
  • Seq. Write (Max.) : 500MB/s
  • Operating Voltage : 3.3V

IM2S31C4

M.2 2242 SSD
  • Form Factor : M.2 2242
  • Capacity : 128GB - 1TB
  • Interface : SATA III
  • Seq. Read (Max.) : 560MB/s
  • Seq. Write (Max.) : 520MB/s
  • Operating Voltage : 3.3V

ADVANTAGES OF DRAM BUFFER

Process smaller packets of amount of data

Better IOPS performance than DRAM-less SSDs

Longer Lifespan

HIGH STABILITY IN HARSH ENVIRONMENT

Thermal Throttling

Ensures data stored in the SSD are safe from extreme temperatures, while also helping to extend SSD lifespan.

Wide-Temp. Operability

Wide temperature support: -40°C to 85°C，use strictly-sorted OG IC and pass stringent validation tests for high stability

ESD Protection

Complies with ESD (Electrostatic Discharge) IEC/EN 61000-4-2 level 4 standard，meets the industrial standard(exclude IM2S31C4)

STRONG INTEGRATION OF HW AND FW

ORIGINAL IC

Implement the high-quality original IC of KIOXIA and WDC to ensure great reliablity.

3K P/E Cycles

*Greatly improve the product endurance. *The P/E cycle is up to 30,000 times with A+ SLC technology

LDPC ECC Technology

Detect errors and fix them for improved data integrity

E2E Data Path Protection

Ensures data be protected during transmission

Wear Leveling

Avoids excessive use of specific chunks of flash memory for improved product longevity

TARGET APPLICATIONS

5G Networking

Automation

Embedded System

Industrial PC

Surveillance

Transportation

e-Catalog

e-Catalog

 Kontakt

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