Samsung ranked #1 in rebounding DRAM revenue among primary DRAM suppliers in 2Q23
• A 8.6% Q/Q revenue increased thanks to demand on inventory buildup by module houses and AI server setups.
• The company’s operating margin improved from -24% to -9%.
WDC enhances data center flexibility and scalability by releasing NVMe flash over fabric (NVMe-oF) solutions
• the new storage solutions enable an ecosystem, providing more possibility to unlock the potential of AI, object storage data centers for cloud, edge, and enterprises.
• WDC is now the only company with vertical integration capabilities on the Ethernet wire, hence is able to deliver solutions for data transferring between server initiator and storage target.
SK Hynix developed next-gen DRAM for AI applications, CS stage underway
• the firm plans to mass produce HBM3E from 1H24, which can process data up to 1.15TB/s, same as processing more than 230 Full-HD movies of 5GB-size each in 1s.
• Hynix plans to bolster its sales of HBM3, DDR5 , LPDDR5, and 176-layer 3D NAND-based SSDs in a bid to increase revenue, as these products lead to a 44% sequential increase in revenue for the 2nd quarter.
• with MR-MUF technology, HBM3E comes with a 10% improvement in heat dissipation.
Micron announced CXL-based sample availability
• 128-256GB CZ120 composes servers with: 1. more memory capacity-build servers with up to 2TB of incremental memory capacity 2. low latency 3. 96%↑ database queries per day 4. 36GB/s memory R/W bandwidth/CPU, 24%↑ better than what a single R-DIMM can do in servers
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▂ |
DDR4 | ● | ▂ | |
DDR5 | ● | ▂ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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