SAMSUNG informed its keynote audience of important product updates to previously-announced mobile storage and high-performance SSD at Flash Memory Summit 2022. The industry’s first UFS 4.0 mobile storage, developed by SAMSUNG in May, is scheduled to enter mass production in August. The new UFS 4.0 will be a critical component in flagship smartphones that require large amounts of data processing for features like high-resolution images and graphics-heavy mobile games, and will later be used in mobility, VR and AR.
Japan's Ministry of Economy, Trade and Industry (METI) has lately announced plans to subsidize Western Digital (WD) and KIOXIA’s NAND flash manufacturing facility for the volume production of the 162-layer 3D NAND flash in Yokkaichi, Mie Prefecture.
SK Hynix aims to select a U.S. site for its advanced chip packaging plant and break ground there around 1Q2023, two people familiar with the matter said, helping the United States to compete as China pours money into chip packaging. The plant, whose estimated cost would be "several billions," would ramp up to mass production by 2025-2026 and employ about 1,000 workers, one of the sources said, declining to be named because details about the plant have not been made public.
Micron announced its plans to invest $40 billion through the end of 2030 to build leading-edge memory manufacturing in multiple phases in the U.S. With the anticipated grants and credits made possible by the CHIPS and Science Act, this investment will enable the world’s most advanced memory manufacturing in America. Micron expects to begin production between 2026 and 2030, ramping overall supply in line with industry demand trends.
Worldwide SSD shipment is estimated to increase in 3Q22.
Global output keeps growing gradually.
NAND Sufficiency: It is expected to be oversupply globally.
Price Trend: Prices are expected to be lower than 1H of 2022.
DRAM Sufficiency: Global demand is weaker, so a slight oversupply is expected to last until end of 2022.
Price Trend: Contract prices remain flat but spot prices are predicted to be lower.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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