Samsung unveiled its updated fabrication technology roadmap at Samsung Foundry Forum (SFF) 2023
• The company is on track to produce chips on its 2nm and 1.4nm-class nodes in 2025 and 2027.
• Samsung intends to add a leading-edge 5nm-class radio frequency manufacturing process and start making gallium nitride (GaN) chips in the coming years.
• The strategic reallocation of resources between Kioxia and WDC could bolster the shipment volume of enterprise SSDs.
• WDC trims its capital investment in R&D team.
• The company’s enterprise SSDs have lagged behind competitors with a notable decline in 2023 NAND flash profits, while its primary North American clients increasingly shift to in-house manufacturing.
SK Hynix begins mass production on 176-Layer to 238-Layer 4D NAND Flash.
• 238-layer process has 50% improvement on transfer speed (up to 2.4Gb/s) comparing to 176-layer, and 20% better RW speed.
• As the smallest NAND size, 238-layer has a 34% higher manufacturing efficiency compared to 176-layer.
• The company is planning to expand 238-layer technology across high-capacity server SSDs after adoption on smartphones.
The U.S. government is contemplating further restricting sales of AI processors to Chinese companies
• The government is deliberating the possibility of imposing constraints on the lease of cloud services from giants including Micron and Amazon.
Q3 Global output is 9.4% lower than that of 3Q22, with a slight drop in quantity from 2Q23 numbers.
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▂ |
DDR4 | ● | ▂ | |
DDR5 | ● | ▂ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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