SAMSUNG has decided to ramp up its wafer production capacities for memory and system semiconductors by around 10% in 2023. Its move is in sharp contrast to those of its rivals such as TSMC, Intel, Micron Technology, and SK Hynix, which all declared a reduction of their investments. SAMSUNG also decided to install more than 10 units of EUV lithography equipment for high-tech DRAM and foundry production. It currently has about 40 units of EUV equipment.
WDC has restarted talks with KIOXIA in a deal that could unite two technology storage providers, according to people familiar with the matter. The value of deals targeting semiconductor companies fell by more than a third last year to about $25 billion.
SK Hynix has set up a global strategy organization to respond to the rapidly changing global business environment and streamlined its internal decision-making system to increase the speed and flexibility of decision-making. It is planning to abolish its existing safety development and manufacturing and business organizations and speed up decision-making between the CEO and heads of major organizations.
Micron on Dec. 21 announced a host of cost-cutting measures, including a 10% workforce reduction, aimed at helping it weather a rapid drop in revenue. It said the worst industry glut in more than a decade would make it difficult to return to profitability next year. Micron also projected a steep sales decline and a wider loss than analysts had estimated for the current quarter.
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▼ |
DDR4 | ● | ▼ | |
DDR5 | ● | ▼ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) | ● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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