
On Nov.29, Samsung unveiled its next-generation graphics memory known as GDDR6W which doubles the performance & capacity versus GDDR6 DRAM. It has also announced that it will expand the application of GDDR6W to small form factor devices such as notebooks as well as new high-performance accelerators used for AI and HPC applications, through cooperation with its GPU partners.
Japan has spotted an opening to build a viable alternative for semiconductors. Now, eight major Japanese tech firms and car makers, including KIOXIA, NEC, NTT, SoftBank, Sony and Toyota, are teaming up in a consortium to launch an advanced chip maker. Rapidus, as it will be called, aims to develop and mass-produce the next generation of logic semiconductors by 2027.


The Ministry of Trade, Industry and Energy announced on Nov. 21 that an agreement on the water issue was reached among SK Hynix, Yeoju City and the central government. As a result, Yeoju City completed all the remaining administrative procedures regarding water supply on Nov. 17. SK Hynix is expected to complete chip production plants at the cluster in 2027.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors specializing in data center market. The combination of 4th Gen AMD EPYC processors and Micron DDR5 delivers up to two times memory bandwidth on the STREAM benchmark and up to two times performance improvement on select HPC workloads such as computational fluid dynamics (OpenFOAM), Weather Research and Forecasting (WRF) modeling and CP2K molecular dynamics.

Except PC DRAM, global output keeps growing gradually in a low growth rate because of the weak demand.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage supports the local storage requirements of Digital Signage, POS, kiosks, and AI retail systems. Explore key SSD selection factors, including interface, capacity, endurance, operating temperature, PLP, S.M.A.R.T. monitoring, and fixed BOM.

TBW、DWPD、P/Eサイクル、pSLC、MLC、TLC、QLCが産業用SSDの耐久性にどのように影響するのかについて解説します。ADATA Industrialからサポートを得ながら、監視、サイバーセキュリティ、エッジワークロードに適したSSDを選定できます。

SSD SMARTデータには、ストレージデバイスの動作状態が継続的に記録されます。累積稼働時間、温度、書き込み量、耐久性の消費状況、利用可能な予備容量、予期しない電力損失の発生などの情報を提供します。

自動車用SSDは、テレマティクス、鉄道用NVR、フリート管理、ADAS、路側エッジシステムなど、過酷な輸送環境で信頼性の高いストレージを実現するために設計されています。ADATAの産業グレードSSDは、-40°C~85°Cで動作し、AEC-Q100 Grade 3に相当する温度範囲をカバーしているため、多くの車載用途に適しています。