
On Nov.29, Samsung unveiled its next-generation graphics memory known as GDDR6W which doubles the performance & capacity versus GDDR6 DRAM. It has also announced that it will expand the application of GDDR6W to small form factor devices such as notebooks as well as new high-performance accelerators used for AI and HPC applications, through cooperation with its GPU partners.
Japan has spotted an opening to build a viable alternative for semiconductors. Now, eight major Japanese tech firms and car makers, including KIOXIA, NEC, NTT, SoftBank, Sony and Toyota, are teaming up in a consortium to launch an advanced chip maker. Rapidus, as it will be called, aims to develop and mass-produce the next generation of logic semiconductors by 2027.


The Ministry of Trade, Industry and Energy announced on Nov. 21 that an agreement on the water issue was reached among SK Hynix, Yeoju City and the central government. As a result, Yeoju City completed all the remaining administrative procedures regarding water supply on Nov. 17. SK Hynix is expected to complete chip production plants at the cluster in 2027.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors specializing in data center market. The combination of 4th Gen AMD EPYC processors and Micron DDR5 delivers up to two times memory bandwidth on the STREAM benchmark and up to two times performance improvement on select HPC workloads such as computational fluid dynamics (OpenFOAM), Weather Research and Forecasting (WRF) modeling and CP2K molecular dynamics.

Except PC DRAM, global output keeps growing gradually in a low growth rate because of the weak demand.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。