
Samsung initiates mass production of UFS 3.1
• This latest automotive memory solution offers the industry’s lowest energy consumption and addresses a wide range of customer needs for optimized in-vehicle infotainment (IVI) systems.
• Samsung aims to expand its presence in the automotive semiconductor market and plans to supply the UFS 3.1 series to global automakers and parts manufacturers by 2023/E.
WDC is trying to reach a deal with Kioxia in August, 2023
• Most of the value in the deal would come from the HDD unit, as WDC posted sales of $1.5B in 2Q23.
• With a mid-30% share, the potential combined company is expected to take on Samsung in the all-important NAND market.


SK Hynix sees DRAM market recovery in its 2nd quarter financial results.
• ASP of DRAM increased due to higher sales of AI servers or other high-end applications.
• Hynix plans to bolster its sales of HBM3, DDR5 , LPDDR5, and 176-layer 3D NAND-based SSDs in a bid to increase revenue, as these products lead to a 44% sequential increase in revenue for the 2nd quarter.
• The company projects a stable demand for AI memory and anticipates a more pronounced effect of production cuts by memory manufacturers.
Micron preps 32Gb DDR5 Chips and high-capacity memory modules in 1H 2024.
• As 1st company to introduce 24Gb DDR5 memory devices and start shipping actual modules, Micron’s 32Gb DDR5 IC will be made on its most advanced production node,1β fabrication technology.
• DDR5 DRAM ICs are particularly useful for datacenter-grade memory modules as they benefit more from high-capacity DRAMs.


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。