
Samsung ranked #1 in rebounding DRAM revenue among primary DRAM suppliers in 2Q23
• A 8.6% Q/Q revenue increased thanks to demand on inventory buildup by module houses and AI server setups.
• The company’s operating margin improved from -24% to -9%.
WDC enhances data center flexibility and scalability by releasing NVMe flash over fabric (NVMe-oF) solutions
• the new storage solutions enable an ecosystem, providing more possibility to unlock the potential of AI, object storage data centers for cloud, edge, and enterprises.
• WDC is now the only company with vertical integration capabilities on the Ethernet wire, hence is able to deliver solutions for data transferring between server initiator and storage target.


SK Hynix developed next-gen DRAM for AI applications, CS stage underway
• the firm plans to mass produce HBM3E from 1H24, which can process data up to 1.15TB/s, same as processing more than 230 Full-HD movies of 5GB-size each in 1s.
• Hynix plans to bolster its sales of HBM3, DDR5 , LPDDR5, and 176-layer 3D NAND-based SSDs in a bid to increase revenue, as these products lead to a 44% sequential increase in revenue for the 2nd quarter.
• with MR-MUF technology, HBM3E comes with a 10% improvement in heat dissipation.
Micron announced CXL-based sample availability
• 128-256GB CZ120 composes servers with: 1. more memory capacity-build servers with up to 2TB of incremental memory capacity 2. low latency 3. 96%↑ database queries per day 4. 36GB/s memory R/W bandwidth/CPU, 24%↑ better than what a single R-DIMM can do in servers


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage supports the local storage requirements of Digital Signage, POS, kiosks, and AI retail systems. Explore key SSD selection factors, including interface, capacity, endurance, operating temperature, PLP, S.M.A.R.T. monitoring, and fixed BOM.

TBW、DWPD、P/Eサイクル、pSLC、MLC、TLC、QLCが産業用SSDの耐久性にどのように影響するのかについて解説します。ADATA Industrialからサポートを得ながら、監視、サイバーセキュリティ、エッジワークロードに適したSSDを選定できます。

SSD SMARTデータには、ストレージデバイスの動作状態が継続的に記録されます。累積稼働時間、温度、書き込み量、耐久性の消費状況、利用可能な予備容量、予期しない電力損失の発生などの情報を提供します。

自動車用SSDは、テレマティクス、鉄道用NVR、フリート管理、ADAS、路側エッジシステムなど、過酷な輸送環境で信頼性の高いストレージを実現するために設計されています。ADATAの産業グレードSSDは、-40°C~85°Cで動作し、AEC-Q100 Grade 3に相当する温度範囲をカバーしているため、多くの車載用途に適しています。