
Samsung maintains production cuts despite rising NAND flash prices
• Samsung is carefully managing supply by instituting a 50% reduction in production to avoid any potential negative impact on NAND profitability.
• The prevailing view holds that the recent uptick in NAND flash prices is attributed more to supply constraints than to an actual surge in demand.
Kioxia offers SK hynix chip making access in Japan
• The firm is giving Hynix the opportunity to produce semiconductors at its Japanese location in a bid to revive its merger talks with Western Digital.
Kioxia and WD JV to receive up to USD 1 billion government subsidy.
The subsidy will be invested in JV’s Japanese facility that will produce its latest generation of 3D flash memory based on the innovative wafer bonding technology and future generation of advanced nodes.


SK hynix will spend big on the development of its HBM tech as competition heats up in the next-gen AI GPU space
•Hynix stated that the 2024 supply of HDM is already sold out. It posted an operating profit of USD 259 million in Q4 2023 after four consecutive quarters of loss.
Micron's 24GB HBM3E chips to power Nvidia's next-gen AI GPUs
•• HBM3E is the latest ultra-fast memory from Micron designed for datacenter and AI-class CPUs, e.g. Nvidia’s H200 that is expected to be launched in Q2’24 with six HBM3E memory chips.
• • Micron is the first firm to announce HBM3E volume production, with bandwidth improvement from the 1TB/s of HBM3 to 1.2TB/s. The firm is also planning HBM3E 36GB chips that is said to have even higher bandwidth and more power efficiency then the 24GB.


after peak shipment in 4Q23, WW SSD demand is expected to grow stably throughout 2024.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▲ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。