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ADATA Industrial to Participate in Embedded World 2026 Leading the New Era of AI-Driven Innovation
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ADATA INDUSTRIAL Unveils AI and Edge Storage Innovations at Embedded World North America 2025
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ADATA Industrial Releases DDR5 6400 CU-DIMM and CSO-DIMM - Empowering HPC with overclocking speed and extraordinary stability
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Monthly Memory & Flash Market Watch
December 2024
Samsung reshuffles semiconductor execs after poor performance in memory and NAND competitiveness
• Samsung has revamped its leadership team to strengthen its memory and foundry chip divisions as it strives to compete with rivals SK hynix and TSMC in the rapidly growing AI market.
• The firm is rumored to suffer from low foundry yields, failing to land strategically important orders from large clients. It has smaller market share of HBM3E memory than SK hynix, and is behind both Micron and SK hynix in terms of validation by Nvidia.
Kioxia adopted for NEDO project to innovate memory under post-5G system infrastructure project
• AI is estimated to generate an unprecedented volume of data in the post-5G information and communication era, next-gen. memories facilitate rapid data transfer with high-performance processors while increasing capacity and reducing power consumption.
• Collaborating with Japan’s national research and development agency-NEDO, Kioxia will focus on the R&D of Compute Express Link (CXL) interface standard to pursue lower power consumption and higher bit density than DRAM, and faster read speed than flash memory.
WDC released SSDs for creators and gamers
• New products include 2-4TB ($280/$430) SanDisk Extreme PRO with USB4 performance portable SSD, 8TB ($800) SanDisk Extreme Portable SSD, 1-2TB ($60/$160) WD_BLACK SN7100 NVMe M.2 SSD, and 2TB ($200) WD_BLACK C50 Expansion Card for Xbox.
SK hynix leads market with HBM3e 16hi products
• This new product features a 48GB capacity per cube and is aimed at applications that include CSPs’ custom ASICs and general-purpose GPUs.The 16hi HBM3e is expected to push memory capacity limits ahead of the HBM4 generation’s launch, with sampling scheduled for 2025 1H.
Micron sampling 6550 ION PCIe Gen5 up to 61TB data center SSD in E3.S form factor
• As the industry’s 1st E3.S and PCIe Gen5 60TB SSD,the 6550 ION excels in high-capacity NVMe workloads such as networked AI data lakes, ingest, data preparation and checkpointng, file and object storage, public cloud storage, analytic databases, and content delivery. It has just entered customer sample stage.
SUPPLY TREND
2024-2025 Worldwide SSD Shipment
WW SSD demand is expected to reach a peak at the end of 2024, and 2025 shipment is expected to grow gradually by quarter
2024-2025 Worldwide DRAM Output
2024-2025 NAND Price Trend & Sufficiency Ratio
Flash Sufficiency: maintained at low level since 2024/B
Price Trend: NAND flash price is likely to drop during 4Q24-1Q25, yet some chip makers plan to do a new round of production cuts to reduce the extent price drops
2024-2025 DDR4 Price Trend & Sufficiency Ratio
DRAM Sufficiency: maintained at extreme low level throughout 2024 but is likely to have more production in 2025 1H to fulfill HBM demands
Price Trend: 8Gb contract price had a strong rebound at Q1/E’24, price level is similar since then. In 2025, DRAM price might drop a bit but remain relatively high from the lowest spot price level
SUPPLY SIGNAL
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▂ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▂ | |
| 3D TLC (BiCS5) | ● | ▼ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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如何運用 SSD SMART 掌握儲存硬碟健康？常見參數說明
SSD SMART 是什麼？本文解析 SATA 與 NVMe SMART 差異，說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數，協助 Edge Storage 與工業設備掌握 SSD 健康狀態。
車用 SSD 是什麼？AEC-Q100 等級、子系統規格
完整解析車用 SSD :AEC-Q100 IC 溫度等級（Grade 0~3）、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格，並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。
NVMe SSDとは？
NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。
ECC DRAMとは？
ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。
NVRストレージの選び方効率的な監視システムに必要となる重要なポイント
NVRストレージを選定する際の主な検討事項：HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。
SSDの動作温度範囲とは？
温度はすべてのSSDを左右する隠れた制限要因であり、SSDの温度範囲は性能仕様であると同時に信頼性仕様でもあります。持続的な負荷がかかると、NVMeファームウェアは複合温度を監視し、軽度または大幅なサーマルスロットリングを開始します。その結果、書き込みスループットが低下し、遅延は急上昇します。また、熱はNAND内部の電荷漏れを加速させ、保持期間の劣化を早めます。この影響は、プログラム/消去サイクルによってセルの劣化が進むほど悪化します。このため、耐久性の消耗が早まり、後にドライブが無通電状態で放置された際のデータ保持トラブルのリスクも高まります。
