Monthly Memory & Flash Market Watch

Kioxia Unveils Upcoming High-Capacity LC9 Series 122.88TB NVMe 2.5-Inch SSD for AI Applications

Sandisk introduces iNAND AT EU752 UFS4.1 EFD

• The LC9 is the firm’s first BiCS8 3D flash QLC 2tb die product, providing a PCIe 5.0 interface and dual-port capability for fault tolerance or connectivity to multiple compute systems. These high-capacity QLC-based SSDs are suitable for deploying in hybrid cloud and multi-cloud systems. High-capacity SSDs feed training and inference data to AI server systems via these cloud configurations.

• Building on its portfolio of advanced automotive-grade storage technology, the iNAND AT EU752 is the first automotive grade UFS4.1 interface device.

• Automotive AI systems such as Advanced Driver Assist Systems (ADAS), Autonomous Driving (AD) and eCockpit need to pull information from sensors, maps and AI databases to function safely. iNAND embedded flash drives become crucial to making sure data is available and reliable when it’s needed and provide real-time in-vehicle storage for the AD computer to overcome latency and connectivity issues that arise when accessing the cloud.

SK hynix showcased memory technology for AI data centers in NVIDIA GTC 2025

• Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM, a new memory standard for AI servers. The company is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within 2025 2H for immediate start of supply to order.* SOCAMM (Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server