
On Nov.29, Samsung unveiled its next-generation graphics memory known as GDDR6W which doubles the performance & capacity versus GDDR6 DRAM. It has also announced that it will expand the application of GDDR6W to small form factor devices such as notebooks as well as new high-performance accelerators used for AI and HPC applications, through cooperation with its GPU partners.
Japan has spotted an opening to build a viable alternative for semiconductors. Now, eight major Japanese tech firms and car makers, including KIOXIA, NEC, NTT, SoftBank, Sony and Toyota, are teaming up in a consortium to launch an advanced chip maker. Rapidus, as it will be called, aims to develop and mass-produce the next generation of logic semiconductors by 2027.


The Ministry of Trade, Industry and Energy announced on Nov. 21 that an agreement on the water issue was reached among SK Hynix, Yeoju City and the central government. As a result, Yeoju City completed all the remaining administrative procedures regarding water supply on Nov. 17. SK Hynix is expected to complete chip production plants at the cluster in 2027.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors specializing in data center market. The combination of 4th Gen AMD EPYC processors and Micron DDR5 delivers up to two times memory bandwidth on the STREAM benchmark and up to two times performance improvement on select HPC workloads such as computational fluid dynamics (OpenFOAM), Weather Research and Forecasting (WRF) modeling and CP2K molecular dynamics.

Except PC DRAM, global output keeps growing gradually in a low growth rate because of the weak demand.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage supports the local storage requirements of Digital Signage, POS, kiosks, and AI retail systems. Explore key SSD selection factors, including interface, capacity, endurance, operating temperature, PLP, S.M.A.R.T. monitoring, and fixed BOM.

TBW, DWPD, P/E 사이클과 pSLC, MLC, TLC, QLC가 산업용 SSD의 내구성에 어떤 영향을 미치는지 알아보세요. ADATA Industrial의 지원을 통해 감시, 사이버 보안 및 엣지 워크로드에 적합한 SSD를 선택할 수 있습니다.

SSD SMART 데이터는 스토리지 장치의 작동 상태를 지속적으로 기록합니다. 누적 작동 시간, 온도, 쓰기 용량, 내구성 소모량, 사용 가능한 예비 용량, 예기치 않은 전력 손실 이벤트 등의 정보를 제공합니다.

자동차용 SSD는 텔레매틱스, 철도 NVR, 차량 관리, ADAS, 도로변 엣지 시스템 등 까다로운 운송 환경에서 안정적인 스토리지를 제공하도록 설계됩니다. ADATA 산업용 등급 SSD는 -40°C~85°C에서 작동하며, 이는 AEC-Q100 Grade 3에 상응하는 온도 범위로 다양한 차량 내 애플리케이션에 적합합니다.