Samsung speeds up in-house CPU Core development with ex-AMD engineer hired Samsung is aiming to use its own CPU cores for both smartphones and laptops, probably only be rolling out by 2027, and it will drop the “Exynos” branding instead calling them “Galaxy Chip(s)”.
WD Kioxia and Western Digital have revealed their jointly developed 8th Generation BiCs 3D NAND memory device featuring 218 active layers. The 2 companies are the first 3D NAND makers in the world to unveil a flash memory IC with a 3200 MT/s I/O, leapfrogging competitors by 33%.
SK Hynix recently published details about its 8th Gen 3D NAND memory device with over 300 active layers. The doubled bit density is expected to increase the per-wafer productivity of the new manufacturing node when it arrives sometime in the 2024-25 timeframe.
· Micron’s DRAM revenue fell by 41.2%, recording the largest revenue decline among suppliers
· Micron’s DRAM capacity utilization rate has fallen to 84% and is expected to stay at this level through 2023
· Micron has begun mass production with its latest 1beta nm process. Its operation in Taiwan will also deploy this process with wafer input scheduled for the middle of 2023, mass production taking place during 2H23.
Global output falls to a new low compared to 2022, while PC DRAM production is recovered slightly.
Type | Supply | Price | |
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DRAM Module |
DDR3 | ● | ▼ |
DDR4 | ● | ▼ | |
DDR5 | ● | ▼ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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