
Samsung announced a partnership with Japanese AI company to supply 2nm-class processors
• Such processors are proprietary AI accelerators for datacenters that the Japanese company, Preferred Networks,will use for its upcoming projects.
• Samsung’s Interposer-Cube S 2.5D packaging technology will also be adopted on the processors, which also allows the firm to build multi-chiplet designs with HBM memory.
Kioxia and Xinnor collaborate to deliver PCIe 5.0 NVMe SSD RAID solution
• Kioxia Gen.5 SSDs have been successfully tested for compatibility and interoperability with the Xinnor, Ltd. (“Xinnor”) RAID solution and achieved up to 25x higher performance running PostgreSQL compared to standard RAID solutions with the same hardware configuration.
• The high performance software RAID solution maximizes the performance of PCIe 5.0 SSDs for AI, Machine Learning (ML) and data analytics applications in on-premises enterprise data centers.
WDC collaborates with 3rd-party controller manufacturers to accelerate the production of PCIe 5.0 SSDs– breaking its tradition of in-house IC development


SK Hynix plans $74.6 billion investment to strengthen its memory chip business
• The firm commands 35% of the DRAM market, planning to focus more on AI technologies with the investment.
• Hynix’s layout in the AI field includes its first PCIe 5.0 SSD development and 300TB SSD designed for data center and on-device AI applications.
Micron announced its 3FQ24 results showing a 17% revenue growth from 2FQ24
• The $6.81 billion revenue has exceeded the firm’s 3FQ24 guidance range thanks to robust AI demand and the gaining share of HBM, as one of its high-margin products. The revenue of data center SSD also hit a record high.

WW SSD demand will not show obvious growth throughout 2024, yet is still recovering gradually.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▲ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSD가 무엇인지, NVMe가 SATA SSD와 어떻게 다른지, 그리고 NVMe 스토리지가 자동화, 산업용 시스템 및 높은 빈도의 데이터 로깅에 왜 적합한지 알아보세요.

안정적인 컴퓨팅을 위한 오류 교정 메모리 이해하기

NVR 스토리지 선택 시 고려해야 할 핵심 사항: 안정적이고 고성능의 감시 시스템을 구축하기 위해 HDD, SSD, 감시용 SSD 및 AI NVR 스토리지 요구 사항을 비교합니다