
Union rally causes Samsung fab production to plummet by 58% during night shift — over 40,000 people attended rally for better pay and bonuses
• The disruption was caused by a large union rally, nearly one‑third of Samsung’s semiconductor fab workforce, showing that even a short labor action can have an immediate and measurable impact on highly automated semiconductor operations. A prolonged strike could undermine Samsung’s lead in next‑generation memory (such as AI‑related chips) and potentially drive customers toward competitors like SK hynix, while also pushing prices higher across the industry.
Kioxia and Dell Technologies first to deliver high-density server with 9.8 PB of flash storage
• The 2 firms demonstrate a major leap in AI storage infrastructure by enabling a 2U server with up to 9.8PB of flash capacity using its LC9 Series 245.76TB NVMe SSDs, highlighting a shift toward ultra-high-density, flash-based architectures. By significantly reducing power consumption, rack space, and total cost of ownership compared to traditional deployments, Kioxia positions its high-capacity SSDs as a key enabler for scaling AI workloads, data lakes, and large-scale analytics efficiently within modern data centers.
SanDisk launches 320/520 SATA SSDs to restore affordable storage
• This move reflects a strategic return to value-oriented SATA products to address supply constraints and restore accessible storage options in a market increasingly dominated by expensive high-performance SSDs. Although limited by SATA interface speeds, these drives focus on affordability, stability, and broad compatibility—making them suitable for budget upgrades, legacy systems, and bulk storage needs.


SK hynix has become a central bottleneck in the AI-driven memory supply chain, with its available capacity effectively fully booked due to surging demand for HBM, DRAM, and NAND. In response, major tech customers are offering to fund new fabs and even purchase costly EUV lithography equipment to secure long-term supply, moving far beyond traditional procurement models. However, SK hynix remains cautious, as accepting such arrangements could limit its pricing power and strategic flexibility in an extremely tight, supplier-driven market.
Micron redefines AI performance with sampling of 256GB DDR5 server module
•This module is built on advanced 1-gamma DRAM and 3D-stacked (TSV-based) packaging, delivers significantly higher bandwidth (up to 9,200 MT/s), capacity, and power efficiency to meet the growing demands of AI workloads such as LLMs and real-time inference. This solution allows data centers to scale AI infrastructure more efficiently within power and thermal limits, accelerating the transition toward high-capacity, performance-optimized server memory architectures.

demand for legacy‑node SSDs is minimal within overall SSD shipments. Rapid expansion in AI‑related applications in 2026 is expected to drive sustained growth in demand for mainstream advanced‑node 3D‑type SSD products.
Flash Sufficiency: Supply has come under significant pressure from Q3’25 through 2026 1H, as manufacturers phase out DDR4 production and reallocate capacity toward high-demand applications from the CSPs. This shift has led to a pronounced tightening in overall DRAM availability.
Price Trend: contract prices continue to move upward, supported by AI-driven enterprise demand and supply discipline, while spot prices have softened due to weaker channel demand and improved short-term supply. Overall, DRAM prices are likely to continue a steady, gradual uptrend over the course of the year.
DRAM Sufficiency: Supply has come under significant pressure from Q3’25 through 2026 1H, as manufacturers phase out DDR4 production and reallocate capacity toward high-demand applications from the CSPs. This shift has led to a pronounced tightening in overall DRAM availability.
Price Trend: contract prices continue to move upward, supported by AI-driven enterprise demand and supply discipline, while spot prices have softened due to weaker channel demand and improved short-term supply. Overall, DRAM prices are likely to continue a steady, gradual uptrend over the course of the year.

Learn what an NVMe SSD is, how NVMe differs from SATA SSDs, and why NVMe storage is ideal for automation, industrial systems, and high-frequency data logging.

Learn what ECC DRAM is, how error correction works, and why it matters for data integrity, system stability, networking security, and mission-critical computing.

NVR 스토리지 선택 시 고려해야 할 핵심 사항: 안정적이고 고성능의 감시 시스템을 구축하기 위해 HDD, SSD, 감시용 SSD 및 AI NVR 스토리지 요구 사항을 비교합니다

온도는 모든 SSD에서 보이지 않는 제한 요소이며 SSD 온도 범위는 성능 사양이자 신뢰성 사양이기도 합니다. 지속적인 부하가 걸리면 NVMe 펌웨어는 종합 온도를 추적하고 가볍거나 강하게 스로틀링을 시작합니다. 그래서 쓰기 처리량은 크게 떨어지고 지연 시간은 급증합니다. 열은 NAND 내부의 전하 누설도 가속시켜 데이터 유지력 감소를 빠르게 만듭니다. 이 효과는 셀이 프로그램/지우기 마모로 노화될수록 더 심해집니다. 따라서 드라이브가 나중에 전원이 꺼진 상태로 남아 있을 때 내구성을 더 빨리 소모하고 데이터 보존 문제의 위험도 높아집니다.

SSD에서의 가비지 컬렉션은 컨트롤러가 조용히 수행하는 정리 작업으로, 여전히 유효한 페이지들을 새로운 공간으로 압축해 옮기고 이제 대부분 쓸모없어진 블록을 지우는 과정이며, NAND 플래시는 이미 프로그램된 페이지를 덮어쓸 수 없기 때문에 먼저 삭제가 필요하고 이 삭제는 페이지 단위가 아니라 블록 단위에서 이루어지므로 결국 업데이트는 “다른 곳에 먼저 쓰고 나중에 정리하는” 방식으로 이루어집니다.

모든 SSD 내부에는 OS가 인식할 수 있는 용량보다 더 많은 물리적 NAND가 존재합니다. 제조업체는 이 플래시의 일부를 사용자 용량으로 표시되지 않는 컨트롤러 전용 공간으로 예약합니다. 이와 같이 예약된 영역을 오버프로비저닝(OP)이라고 합니다. 예를 들어 TechTarget에 따르면 물리적 NAND 용량이 976GB인 SSD에서 호스트가 접근할 수 있는 용량은 800GB에 불과하며, 나머지 176GB는 컨트롤러 전용 오버프로비저닝 용량으로 남겨 둡니다. 또한 이 공간에는 FTL 매핑 테이블과 배드 블록 풀과 같은 내부 메타데이터가 저장됩니다. 따라서 SSD 오버프로비저닝이 무엇인지 묻는다는 것은 실제로 드라이브 내부에 있는 이러한 숨겨진 작업 공간을 의미합니다.