
Union rally causes Samsung fab production to plummet by 58% during night shift — over 40,000 people attended rally for better pay and bonuses
• The disruption was caused by a large union rally, nearly one‑third of Samsung’s semiconductor fab workforce, showing that even a short labor action can have an immediate and measurable impact on highly automated semiconductor operations. A prolonged strike could undermine Samsung’s lead in next‑generation memory (such as AI‑related chips) and potentially drive customers toward competitors like SK hynix, while also pushing prices higher across the industry.
Kioxia and Dell Technologies first to deliver high-density server with 9.8 PB of flash storage
• The 2 firms demonstrate a major leap in AI storage infrastructure by enabling a 2U server with up to 9.8PB of flash capacity using its LC9 Series 245.76TB NVMe SSDs, highlighting a shift toward ultra-high-density, flash-based architectures. By significantly reducing power consumption, rack space, and total cost of ownership compared to traditional deployments, Kioxia positions its high-capacity SSDs as a key enabler for scaling AI workloads, data lakes, and large-scale analytics efficiently within modern data centers.
SanDisk launches 320/520 SATA SSDs to restore affordable storage
• This move reflects a strategic return to value-oriented SATA products to address supply constraints and restore accessible storage options in a market increasingly dominated by expensive high-performance SSDs. Although limited by SATA interface speeds, these drives focus on affordability, stability, and broad compatibility—making them suitable for budget upgrades, legacy systems, and bulk storage needs.


SK hynix has become a central bottleneck in the AI-driven memory supply chain, with its available capacity effectively fully booked due to surging demand for HBM, DRAM, and NAND. In response, major tech customers are offering to fund new fabs and even purchase costly EUV lithography equipment to secure long-term supply, moving far beyond traditional procurement models. However, SK hynix remains cautious, as accepting such arrangements could limit its pricing power and strategic flexibility in an extremely tight, supplier-driven market.
Micron redefines AI performance with sampling of 256GB DDR5 server module
•This module is built on advanced 1-gamma DRAM and 3D-stacked (TSV-based) packaging, delivers significantly higher bandwidth (up to 9,200 MT/s), capacity, and power efficiency to meet the growing demands of AI workloads such as LLMs and real-time inference. This solution allows data centers to scale AI infrastructure more efficiently within power and thermal limits, accelerating the transition toward high-capacity, performance-optimized server memory architectures.

demand for legacy‑node SSDs is minimal within overall SSD shipments. Rapid expansion in AI‑related applications in 2026 is expected to drive sustained growth in demand for mainstream advanced‑node 3D‑type SSD products.
Flash Sufficiency: Supply has come under significant pressure from Q3’25 through 2026 1H, as manufacturers phase out DDR4 production and reallocate capacity toward high-demand applications from the CSPs. This shift has led to a pronounced tightening in overall DRAM availability.
Price Trend: contract prices continue to move upward, supported by AI-driven enterprise demand and supply discipline, while spot prices have softened due to weaker channel demand and improved short-term supply. Overall, DRAM prices are likely to continue a steady, gradual uptrend over the course of the year.
DRAM Sufficiency: Supply has come under significant pressure from Q3’25 through 2026 1H, as manufacturers phase out DDR4 production and reallocate capacity toward high-demand applications from the CSPs. This shift has led to a pronounced tightening in overall DRAM availability.
Price Trend: contract prices continue to move upward, supported by AI-driven enterprise demand and supply discipline, while spot prices have softened due to weaker channel demand and improved short-term supply. Overall, DRAM prices are likely to continue a steady, gradual uptrend over the course of the year.

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage supports the local storage requirements of Digital Signage, POS, kiosks, and AI retail systems. Explore key SSD selection factors, including interface, capacity, endurance, operating temperature, PLP, S.M.A.R.T. monitoring, and fixed BOM.

TBW, DWPD, P/E 사이클과 pSLC, MLC, TLC, QLC가 산업용 SSD의 내구성에 어떤 영향을 미치는지 알아보세요. ADATA Industrial의 지원을 통해 감시, 사이버 보안 및 엣지 워크로드에 적합한 SSD를 선택할 수 있습니다.

SSD SMART 데이터는 스토리지 장치의 작동 상태를 지속적으로 기록합니다. 누적 작동 시간, 온도, 쓰기 용량, 내구성 소모량, 사용 가능한 예비 용량, 예기치 않은 전력 손실 이벤트 등의 정보를 제공합니다.

자동차용 SSD는 텔레매틱스, 철도 NVR, 차량 관리, ADAS, 도로변 엣지 시스템 등 까다로운 운송 환경에서 안정적인 스토리지를 제공하도록 설계됩니다. ADATA 산업용 등급 SSD는 -40°C~85°C에서 작동하며, 이는 AEC-Q100 Grade 3에 상응하는 온도 범위로 다양한 차량 내 애플리케이션에 적합합니다.