
AMD to use Samsung's 3nm tech as it looks to dual-source future chips
• The firm stated at ITF World 2024 that it will mass-produce chips on a 3-nm-class GAA process, and Samsung Foundry is the only company to offer such production technology.
• Using Samsung Foundry as 2nd source other than TSMC is considered AMD’s strategy to expand its manufacturing capacity, sell more products, and gain leverage for price negotiations with TSMC.
Kioxia showcased in Dell Technologies World product lineup designed to meet evolving IT demands of the future
• The company highlighted its PCIe 5.0 SSDs in the show, stressing the benefits over PCIe 4.0 SSDs in a variety of real-world server and storage configurations/workload combinations including CD8 U.2 for data center and CM7 E3.S enterprise NVMe SSDs.
Western Digital launched WW Highest Capacity 6TB 2.5-Inch HDDs
• The record-breaking HDD features 256-bit AES hardware encryption to achieve password protection.


SK Hynix working on products suitable for datacenter AI training, edge AI, and on-device AI inference
• Such products include 300TB SSD, HBM4, CXL Pooled Memory Solutions, LPDDR6, GDDR7, and high-capacity DDR5.
• The 300TB SSD is considered a rival for Samsung's PBSSD initiative which is limited to storing 240TB of data.
Micron speeds up to 5,600MT/s in 32Gb die-based 128G DDR5 R-DIMM on leading server platforms
• The DDR5 R-DIMM is based on 1β technology, which delivers more than 45% improved bit density, up to 22% improved energy efficiency, and up to 16% lower latency over competitive products with 3DS TSV packaging technology.
• Such an advanced product will be supported by ecosystems including AMD, HPE, Intel, and Supermicro.

WW SSD demand will not show obvious growth throughout 2024, yet is still recovering gradually.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▲ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

醫療設備正在快速數位化。從實務上來看,醫學影像、病患監測、內視鏡系統、自動調劑櫃,到醫療邊緣閘道器,越來越多設備負責執行檢查或治療流程也同時需要即時記錄影像、感測數據、操作紀錄、警報事件與系統狀態。 對醫療設備製造商來說,儲存裝置已經從容量規格的一部分,升級為影響資料完整性、設備穩定性與產品生命週期的重要元件。

了解 NVMe SSD 的定義、NVMe 與 SATA SSD 的差異,以及為何 NVMe 儲存裝置適合自動化、工業系統和高頻資料記錄

了解 ECC DRAM 的定義、除錯運作原理,以及它對資料完整性、系統穩定性、網路安全與關鍵任務運算的重要性。

解析NVR Storage選購重點,深入比較HDD和SSD、Surveillance SSD與AI NVR儲存需求,打造穩定高效的監控系統

溫度是每顆 SSD 的隱形限制器,而 SSD 溫度範圍既是效能規格也是可靠性規格。在持續負載下,NVMe 韌體會追蹤複合溫度,並會開始輕度或重度節流。因此,寫入吞吐量大幅下降,延遲飆升。高溫也會加速 NAND 內部的電荷洩漏,這會加速資料保留損失。隨著單元因編程/抹除磨損而老化,這種效應會惡化。因此,當硬碟稍後保持未通電狀態時,您會更快消耗耐用度並提高資料保留問題的風險。

SSD 中的垃圾回收是控制器的靜態清理工作。它將仍然有效的頁面壓縮到新空間,並抹除現在大多是垃圾的區塊。這聽起來很奇怪,直到您記起 NAND 快閃記憶體無法覆寫已編程的頁面。它必須先抹除,而抹除是在區塊層級進行,而非每個頁面。因此,更新變成「先寫到別處,之後再清理」。