
Samsung developing memory chip density to extreme levels
• 11-nanometer DRAM and 9th Gen. V-NAND are both under development to meet the need of hyperscale AI devices, which requires high-performance, high-capacity, and low-power memory.
• The company is also mass producing HBM products to increase proportion of power AI,data center, and machine learning platforms revenue.
WD’s board of directors approved a plan to separate its HDD and flash businesses
• The separation will better position each franchise to execute innovative technology and product development, and capitalize on unique growth opportunities
Kioxia reported a record net loss of $1.3 billion in FY2Q23, reflecting the broader challenges in semiconductor demand
• Toshiba will be delisted from the Tokyo Stock Exchange on Dec.,20,2023, following Japan Industrial Partners’s $1.4M takeover.


SK hynix's market share of the DRAM market has reached 35% as of 3Q23
• Growth fueled by demand for AI chips, lifting demand for HBM products as well.
• The firm already accounted for 50% market share of HBM in Apr.’23, although this product line only represents 10% of DRAM revenue.
Micron announced its 32Gb monolithic die-based 128GB DDR5 RDIMM memory
• The product features performance of up to 8,000MT/s to support data center workloads today and into the future.
• Targeted mission-critical applications: AI, in-memory databases (IMDBs), processing for multithreaded, multicore count general compute workloads in data center and cloud environments.


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Signage Storage 涵蓋 Digital Signage、POS、Kiosk 與 AI 零售設備的本機儲存需求。本文解析 SSD 介面、容量、耐寫度、工作溫度、PLP、SMART 監控與固定 BOM 等選型重點。

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

醫療設備正在快速數位化。從實務上來看,醫學影像、病患監測、內視鏡系統、自動調劑櫃,到醫療邊緣閘道器,越來越多設備負責執行檢查或治療流程也同時需要即時記錄影像、感測數據、操作紀錄、警報事件與系統狀態。 對醫療設備製造商來說,儲存裝置已經從容量規格的一部分,升級為影響資料完整性、設備穩定性與產品生命週期的重要元件。
