
Samsung developing memory chip density to extreme levels
• 11-nanometer DRAM and 9th Gen. V-NAND are both under development to meet the need of hyperscale AI devices, which requires high-performance, high-capacity, and low-power memory.
• The company is also mass producing HBM products to increase proportion of power AI,data center, and machine learning platforms revenue.
WD’s board of directors approved a plan to separate its HDD and flash businesses
• The separation will better position each franchise to execute innovative technology and product development, and capitalize on unique growth opportunities
Kioxia reported a record net loss of $1.3 billion in FY2Q23, reflecting the broader challenges in semiconductor demand
• Toshiba will be delisted from the Tokyo Stock Exchange on Dec.,20,2023, following Japan Industrial Partners’s $1.4M takeover.


SK hynix's market share of the DRAM market has reached 35% as of 3Q23
• Growth fueled by demand for AI chips, lifting demand for HBM products as well.
• The firm already accounted for 50% market share of HBM in Apr.’23, although this product line only represents 10% of DRAM revenue.
Micron announced its 32Gb monolithic die-based 128GB DDR5 RDIMM memory
• The product features performance of up to 8,000MT/s to support data center workloads today and into the future.
• Targeted mission-critical applications: AI, in-memory databases (IMDBs), processing for multithreaded, multicore count general compute workloads in data center and cloud environments.


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

Signage Storage 涵蓋 Digital Signage、POS、Kiosk 與 AI 零售設備的本機儲存需求。本文解析 SSD 介面、容量、耐寫度、工作溫度、PLP、SMART 監控與固定 BOM 等選型重點。

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。