成功案例

成功案例

成功案例

应用产品

Die Bonder

客户

A leading semiconductor equipment designer and manufacturer in APAC

威刚解决方案

DDR4 U-DIMM Series

Customer Requirements

Modern die bonders require industrial-grade memory to enhance system stability. To meet these demands, the customer needed a solution that would support long-duration, high-precision bonding operations. This ensures consistent performance for fine-pitch applications, advanced packages, and high-volume production, while also enabling more sophisticated process control and optimization.

ADATA Industrial Solution

ADATA provided U-DIMM DDR4 2400MHz memory module, offering a tailored industrial-grade solution:

DDR4 U-DIMM
DDR4 U-DIMM

DDR4, U-DIMM

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