Samsung initiates mass production of UFS 3.1
• This latest automotive memory solution offers the industry’s lowest energy consumption and addresses a wide range of customer needs for optimized in-vehicle infotainment (IVI) systems.
• Samsung aims to expand its presence in the automotive semiconductor market and plans to supply the UFS 3.1 series to global automakers and parts manufacturers by 2023/E.
WDC is trying to reach a deal with Kioxia in August, 2023
• Most of the value in the deal would come from the HDD unit, as WDC posted sales of $1.5B in 2Q23.
• With a mid-30% share, the potential combined company is expected to take on Samsung in the all-important NAND market.
SK Hynix sees DRAM market recovery in its 2nd quarter financial results.
• ASP of DRAM increased due to higher sales of AI servers or other high-end applications.
• Hynix plans to bolster its sales of HBM3, DDR5 , LPDDR5, and 176-layer 3D NAND-based SSDs in a bid to increase revenue, as these products lead to a 44% sequential increase in revenue for the 2nd quarter.
• The company projects a stable demand for AI memory and anticipates a more pronounced effect of production cuts by memory manufacturers.
Micron preps 32Gb DDR5 Chips and high-capacity memory modules in 1H 2024.
• As 1st company to introduce 24Gb DDR5 memory devices and start shipping actual modules, Micron’s 32Gb DDR5 IC will be made on its most advanced production node,1β fabrication technology.
• DDR5 DRAM ICs are particularly useful for datacenter-grade memory modules as they benefit more from high-capacity DRAMs.
Type | Supply | Price | |
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DRAM Module |
DDR3 | ● | ▂ |
DDR4 | ● | ▂ | |
DDR5 | ● | ▂ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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