On Nov.29, Samsung unveiled its next-generation graphics memory known as GDDR6W which doubles the performance & capacity versus GDDR6 DRAM. It has also announced that it will expand the application of GDDR6W to small form factor devices such as notebooks as well as new high-performance accelerators used for AI and HPC applications, through cooperation with its GPU partners.
Japan has spotted an opening to build a viable alternative for semiconductors. Now, eight major Japanese tech firms and car makers, including KIOXIA, NEC, NTT, SoftBank, Sony and Toyota, are teaming up in a consortium to launch an advanced chip maker. Rapidus, as it will be called, aims to develop and mass-produce the next generation of logic semiconductors by 2027.
The Ministry of Trade, Industry and Energy announced on Nov. 21 that an agreement on the water issue was reached among SK Hynix, Yeoju City and the central government. As a result, Yeoju City completed all the remaining administrative procedures regarding water supply on Nov. 17. SK Hynix is expected to complete chip production plants at the cluster in 2027.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors specializing in data center market. The combination of 4th Gen AMD EPYC processors and Micron DDR5 delivers up to two times memory bandwidth on the STREAM benchmark and up to two times performance improvement on select HPC workloads such as computational fluid dynamics (OpenFOAM), Weather Research and Forecasting (WRF) modeling and CP2K molecular dynamics.
Except PC DRAM, global output keeps growing gradually in a low growth rate because of the weak demand.
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▼ |
DDR4 | ● | ▼ | |
DDR5 | ● | ▼ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) | ● | ▂ | |
3D TLC (BiCS4) | ● | ▼ | |
3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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