Samsung announced severe cuts to its memory chip production due to decreased market demand
• market observers believe the cuts will focus on DDR4
• NAND flash and memory IC inventory equalization could happen as soon as Q3 2023 “Exynos” branding instead calling them “Galaxy Chip(s)”.
• Hackers who breached WDC are pushing the company to negotiate a ransom in exchange for not publishing the stolen data
• Kioxia Corporation entered into a long-term agreement to license Adeia’s semiconductor patent portfolio
Adeia licenses and partners with WW semiconductor companies with a large portfolio of intellectual property covering hybrid bonding, semiconductor packaging, and semiconductor processing technologies
SK Hynix’s high bandwidth memory (HBM) market share to exceed 50% in 2023.
• HBM market share of other suppliers: Samsung 40% Micron 10%
• Hynix is the only supplier that mass produces HBM3 products, preparing for the launch of NVIDIA H100 and AMD MI300 in 2H23.
Micron 2Q23 revenue was $3.7 billion, down 53% Y/Y
• revenue composition: DRAM 74%, NAND 24% NAND: 1.176/232L represent over 90% of NAND bit production 2.Micron 2400 as the only 176L QLC SSD qualified at OEMs.
• revenue by BU: compute & networking (21%↓ Q/Q) > mobile (44%↑ Q/Q) > embedded (14%↓ Q/Q) > storage (25%↓ Q/Q) compute & networking: cloud going down while consumer being stable embedded: automotive markets were relatively stable compared to industrial and consumer ones
Global output drops to a new low compared to 2022, especially mobile RAM supply, while PC DRAM production is recovered slightly.
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▂ |
DDR4 | ● | ▂ | |
DDR5 | ● | ▂ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▂ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
3D TLC (BiCS4) | ● | ▂ | |
3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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