
Samsung initiates mass production of UFS 3.1
• This latest automotive memory solution offers the industry’s lowest energy consumption and addresses a wide range of customer needs for optimized in-vehicle infotainment (IVI) systems.
• Samsung aims to expand its presence in the automotive semiconductor market and plans to supply the UFS 3.1 series to global automakers and parts manufacturers by 2023/E.
WDC is trying to reach a deal with Kioxia in August, 2023
• Most of the value in the deal would come from the HDD unit, as WDC posted sales of $1.5B in 2Q23.
• With a mid-30% share, the potential combined company is expected to take on Samsung in the all-important NAND market.


SK Hynix sees DRAM market recovery in its 2nd quarter financial results.
• ASP of DRAM increased due to higher sales of AI servers or other high-end applications.
• Hynix plans to bolster its sales of HBM3, DDR5 , LPDDR5, and 176-layer 3D NAND-based SSDs in a bid to increase revenue, as these products lead to a 44% sequential increase in revenue for the 2nd quarter.
• The company projects a stable demand for AI memory and anticipates a more pronounced effect of production cuts by memory manufacturers.
Micron preps 32Gb DDR5 Chips and high-capacity memory modules in 1H 2024.
• As 1st company to introduce 24Gb DDR5 memory devices and start shipping actual modules, Micron’s 32Gb DDR5 IC will be made on its most advanced production node,1β fabrication technology.
• DDR5 DRAM ICs are particularly useful for datacenter-grade memory modules as they benefit more from high-capacity DRAMs.


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

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TBW、DWPD、P/Eサイクル、pSLC、MLC、TLC、QLCが産業用SSDの耐久性にどのように影響するのかについて解説します。ADATA Industrialからサポートを得ながら、監視、サイバーセキュリティ、エッジワークロードに適したSSDを選定できます。

SSD SMARTデータには、ストレージデバイスの動作状態が継続的に記録されます。累積稼働時間、温度、書き込み量、耐久性の消費状況、利用可能な予備容量、予期しない電力損失の発生などの情報を提供します。

自動車用SSDは、テレマティクス、鉄道用NVR、フリート管理、ADAS、路側エッジシステムなど、過酷な輸送環境で信頼性の高いストレージを実現するために設計されています。ADATAの産業グレードSSDは、-40°C~85°Cで動作し、AEC-Q100 Grade 3に相当する温度範囲をカバーしているため、多くの車載用途に適しています。