Samsung announced its LPCAMM development that leverages LPDDR5X memory
• LPDDR5X-6400 features: 1.delivers up to 7.5Gbps memory throughput 2.consumes 60% less board space while delivering 50% more performance than regular SO-DIMM 3.could potentially be used for data centers
• The company has validated LPCAMM’s compatibility with Intel’s systems and will test systems with other major unspecified customers in 2023.
Kioxia Holdings Corp.’s lenders prep $14 billion loan for Western Digital merger
• WDC will hold about 50.5% of the combined holding company, while the remaining will be held by Kioxia under the terms of the deal being discussed.
• WDC’s hard drive business is expected to remain separate and is not part of the deal.
U.S. to prolong special permission for SK Hynix to import chipmaking tools for its Chinese fabs
• such permission does not require additional licensing and applies to Samsung as well.
• if Hynix receives grants from the U.S CHIPS & Science Act, all restrictions regarding investments in China will apply.
• U.S government made the exception to ensure sufficient memory output for American firms.
Micron’s 2024 market outlook & capex plan in its 4FQ23 report
*4FQ23 highlight: $4.01 billion (vs.$6.64 billion for 4FQ22)
• Supply: 1. industry DRAM and NAND supply growth to be below industry demand growth 2. demand at leading-edge nodes is expected to exceed the supply of Micron in fiscal and CY24
• CY24 bit demand growth projection: DRAM-exceeds long-term CAGR // NAND-near long-term CAGR
Type | Supply | Price | |
---|---|---|---|
DRAM Module |
DDR3 | ● | ▲ |
DDR4 | ● | ▲ | |
DDR5 | ● | ▲ | |
Flash Storage |
SLC | ● | ▂ |
MLC | ● | ▲ | |
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
3D TLC (BiCS4) | ● | ▲ | |
3D TLC (BiCS5) | ● | ▲ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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