
SAMSUNG informed its keynote audience of important product updates to previously-announced mobile storage and high-performance SSD at Flash Memory Summit 2022. The industry’s first UFS 4.0 mobile storage, developed by SAMSUNG in May, is scheduled to enter mass production in August. The new UFS 4.0 will be a critical component in flagship smartphones that require large amounts of data processing for features like high-resolution images and graphics-heavy mobile games, and will later be used in mobility, VR and AR.
Japan's Ministry of Economy, Trade and Industry (METI) has lately announced plans to subsidize Western Digital (WD) and KIOXIA’s NAND flash manufacturing facility for the volume production of the 162-layer 3D NAND flash in Yokkaichi, Mie Prefecture.


SK Hynix aims to select a U.S. site for its advanced chip packaging plant and break ground there around 1Q2023, two people familiar with the matter said, helping the United States to compete as China pours money into chip packaging. The plant, whose estimated cost would be "several billions," would ramp up to mass production by 2025-2026 and employ about 1,000 workers, one of the sources said, declining to be named because details about the plant have not been made public.
Micron announced its plans to invest $40 billion through the end of 2030 to build leading-edge memory manufacturing in multiple phases in the U.S. With the anticipated grants and credits made possible by the CHIPS and Science Act, this investment will enable the world’s most advanced memory manufacturing in America. Micron expects to begin production between 2026 and 2030, ramping overall supply in line with industry demand trends.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Learn how to choose server RAM, including ECC, UDIMM vs. RDIMM, DDR4 vs. DDR5, memory capacity, platform compatibility, and industrial server applications.

Compare ECC RAM vs. Non-ECC RAM and learn how ECC Memory corrects memory errors, how DDR5 On-Die ECC differs from system-level ECC, what platform compatibility requirements to consider, and how to choose between ECC UDIMM, RDIMM, and SODIMM for medical, networking, NVR, Edge AI, and transportation applications.

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TBW、DWPD、P/Eサイクル、pSLC、MLC、TLC、QLCが産業用SSDの耐久性にどのように影響するのかについて解説します。ADATA Industrialからサポートを得ながら、監視、サイバーセキュリティ、エッジワークロードに適したSSDを選定できます。

SSD SMARTデータには、ストレージデバイスの動作状態が継続的に記録されます。累積稼働時間、温度、書き込み量、耐久性の消費状況、利用可能な予備容量、予期しない電力損失の発生などの情報を提供します。

自動車用SSDは、テレマティクス、鉄道用NVR、フリート管理、ADAS、路側エッジシステムなど、過酷な輸送環境で信頼性の高いストレージを実現するために設計されています。ADATAの産業グレードSSDは、-40°C~85°Cで動作し、AEC-Q100 Grade 3に相当する温度範囲をカバーしているため、多くの車載用途に適しています。