
Samsung was by far the biggest source of leading- and lagging-edge capacity at the end of 2022 according to Knometa Research's new Global Wafer Capacity 2023 report. Not only being the top supplier of DRAM and NAND flash memory products in the market, the company is also one of the biggest producers of advanced logic products, including SoCs for the fabless semiconductor sector and low-power, high-performance application processors for its own smartphones.
WD has released its highest capacity consumer drive with the 22TB (*) My Book desktop HDD, which is able to consolidate data from a variety of users’ storage devices into one organized and easy to access location. The company’s My Book Duo series is also available in a 44TB (*) capacity, equipped with RAID-optimized company drives that enables maximum speed and capacity. My Book Duo can be reconfigured to RAID-1 for redundancy (data mirroring) or used as 2 independent drives (JBOD) with the included software.


SK Hynix’s 2022 operating profit plunged 44% as its first operating loss in over ten years, despite revenue increasing by 4% compared to 2021. The loss result was compounded by lowered demand for memory chips and a significant drop in memory pricing, which also reflected the overall downward spiral of the PC industry during the second half of 2022. However, the company forecasts market conditions to gradually improve in the latter part of 2023 and expects to see a quick turnaround, with the world’s best technologies for DDR5 for data centers and 176-layer NAND flash-based enterprise SSD.
Micron is by far the biggest owner of offshore IC manufacturer capacity. The company operates 12 fabs outside of the US and accounts for 65% of the 2.6 million wafers produced overseas. Yet recently Micron announced that it will return to the US and build new fabs in Idaho and New York. However, Micron has also claimed to slow down its local capacity expansion as global memory business is weak, especially when the cost of memory mass-production in the US is much higher than that of its fabs in Taiwan, Japan and Singapore.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。