
Samsung announced severe cuts to its memory chip production due to decreased market demand
• market observers believe the cuts will focus on DDR4
• NAND flash and memory IC inventory equalization could happen as soon as Q3 2023 “Exynos” branding instead calling them “Galaxy Chip(s)”.
• Hackers who breached WDC are pushing the company to negotiate a ransom in exchange for not publishing the stolen data
• Kioxia Corporation entered into a long-term agreement to license Adeia’s semiconductor patent portfolio
Adeia licenses and partners with WW semiconductor companies with a large portfolio of intellectual property covering hybrid bonding, semiconductor packaging, and semiconductor processing technologies


SK Hynix’s high bandwidth memory (HBM) market share to exceed 50% in 2023.
• HBM market share of other suppliers: Samsung 40% Micron 10%
• Hynix is the only supplier that mass produces HBM3 products, preparing for the launch of NVIDIA H100 and AMD MI300 in 2H23.
Micron 2Q23 revenue was $3.7 billion, down 53% Y/Y
• revenue composition: DRAM 74%, NAND 24% NAND: 1.176/232L represent over 90% of NAND bit production 2.Micron 2400 as the only 176L QLC SSD qualified at OEMs.
• revenue by BU: compute & networking (21%↓ Q/Q) > mobile (44%↑ Q/Q) > embedded (14%↓ Q/Q) > storage (25%↓ Q/Q) compute & networking: cloud going down while consumer being stable embedded: automotive markets were relatively stable compared to industrial and consumer ones

Global output drops to a new low compared to 2022, especially mobile RAM supply, while PC DRAM production is recovered slightly.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。