
Samsung unveiled its updated fabrication technology roadmap at Samsung Foundry Forum (SFF) 2023
• The company is on track to produce chips on its 2nm and 1.4nm-class nodes in 2025 and 2027.
• Samsung intends to add a leading-edge 5nm-class radio frequency manufacturing process and start making gallium nitride (GaN) chips in the coming years.
• The strategic reallocation of resources between Kioxia and WDC could bolster the shipment volume of enterprise SSDs.
• WDC trims its capital investment in R&D team.
• The company’s enterprise SSDs have lagged behind competitors with a notable decline in 2023 NAND flash profits, while its primary North American clients increasingly shift to in-house manufacturing.


SK Hynix begins mass production on 176-Layer to 238-Layer 4D NAND Flash.
• 238-layer process has 50% improvement on transfer speed (up to 2.4Gb/s) comparing to 176-layer, and 20% better RW speed.
• As the smallest NAND size, 238-layer has a 34% higher manufacturing efficiency compared to 176-layer.
• The company is planning to expand 238-layer technology across high-capacity server SSDs after adoption on smartphones.
The U.S. government is contemplating further restricting sales of AI processors to Chinese companies
• The government is deliberating the possibility of imposing constraints on the lease of cloud services from giants including Micron and Amazon.


Q3 Global output is 9.4% lower than that of 3Q22, with a slight drop in quantity from 2Q23 numbers.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

解析工業級SSD的TBW、DWPD、P/E循環與pSLC/MLC/TLC/QLC差異,依監控、網安、邊緣運算等工作負載選對耐用型固態硬碟。威剛工業級提供選型與樣品支援。

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。