AMD to use Samsung's 3nm tech as it looks to dual-source future chips
• The firm stated at ITF World 2024 that it will mass-produce chips on a 3-nm-class GAA process, and Samsung Foundry is the only company to offer such production technology.
• Using Samsung Foundry as 2nd source other than TSMC is considered AMD’s strategy to expand its manufacturing capacity, sell more products, and gain leverage for price negotiations with TSMC.
Kioxia showcased in Dell Technologies World product lineup designed to meet evolving IT demands of the future
• The company highlighted its PCIe 5.0 SSDs in the show, stressing the benefits over PCIe 4.0 SSDs in a variety of real-world server and storage configurations/workload combinations including CD8 U.2 for data center and CM7 E3.S enterprise NVMe SSDs.
Western Digital launched WW Highest Capacity 6TB 2.5-Inch HDDs
• The record-breaking HDD features 256-bit AES hardware encryption to achieve password protection.
SK Hynix working on products suitable for datacenter AI training, edge AI, and on-device AI inference
• Such products include 300TB SSD, HBM4, CXL Pooled Memory Solutions, LPDDR6, GDDR7, and high-capacity DDR5.
• The 300TB SSD is considered a rival for Samsung's PBSSD initiative which is limited to storing 240TB of data.
Micron speeds up to 5,600MT/s in 32Gb die-based 128G DDR5 R-DIMM on leading server platforms
• The DDR5 R-DIMM is based on 1β technology, which delivers more than 45% improved bit density, up to 22% improved energy efficiency, and up to 16% lower latency over competitive products with 3DS TSV packaging technology.
• Such an advanced product will be supported by ecosystems including AMD, HPE, Intel, and Supermicro.
WW SSD demand will not show obvious growth throughout 2024, yet is still recovering gradually.
NAND Sufficiency: maintained at extreme low level from 2H23
Price Trend: NAND flash price is expected to climb continuously at least until 3Q24
DRAM Sufficiency: maintained at extreme low level throughout 2024
Price Trend: 8Gb contract price had another rebound at Q2/B after the severe price increase in Jan./24. It will remain at a higher level than the spot low trend in 2024
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▲ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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