
Samsung's foundry customers reportedly flock to TSMC
• South Korean developers of AI processors that used to make chips at Samsung Foundry including DeepX, FuriosaAI, and Mobilint, are turning to TSMC to diversify their supply. This helps pricing negotiation and is a failsafe if one of the chips fails to become successful.
Nanya to develop vertical channel transistor DRAM technology with Kioxia
• This innovation focuses on reducing power consumption and achieving extremely low leakage current by using oxide semiconductors, enhancing circuit integration by improving the manufacturing process.
• The collaboration reflects efforts of the 2 firms to meet the increasing demand for energy efficiency and performance in high-density applications, including AI-driven devices, post-5G communication, and IoT.
WD split between HDD and SSD products
• The firm intends to improve operational focus and create two independent, more agile companies-WesternDigital.com for all HDD and platform products and SanDisk.com for all flash products. The formal split was set to be completed in 2024 2H.


SK hynix begins volume production of 12-Layer 36GB HBM3E memory
• This 5th-gen HBM is so far the highest-performing and highest-capacity memory product, its chip is made 40% thinner than the 8-layer generation, which increases 12-layer chip’s capacity by 50%. Hynix plans to supply mass-produced products by 2024/E.
Micron Gen5 data center SSDs qualified for recommended vendor list on Nvidia GB200 NVL72 and its derivatives
• The 9550 NVMe SSD delivers world-class AI workload performance and power efficiency:(1) up to 34% higher throughput for Nvidia Magnum IO GPUDirect (2) up to 33% faster workload completion times in graph neural network training with Big Accelerator Memory (3) saves energy and sets new sustainability benchmarks by consuming 81% less SSD energy per 1TB transferred than other SSD offerings.

WW SSD demand is expected to reach a peak at the end of 2024, and 2025 general shipping status is likely to stay above 2024’s quarterly level
Flash Sufficiency: maintained at low level since 2024/B
Price Trend: NAND flash price is likely to drop during 4Q24-1Q25, yet some chip makers plan a new round of production cuts to reduce price drop extent
DRAM Sufficiency: maintained at extreme low level throughout 2024 but is likely to have more production in 1Q25 to fulfill HBM demands
Price Trend: 8Gb contract price had a strong bound at Q1/E’24, price maintained at similar level since then. In 2025, DRAM price may drop a bit but remains relatively high compared to lowest spot price level
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS5 |
● | ▂ | |
|
3D TLC (BiCS4) * Tight supply. We encourage you to migrate to BICS5. |
● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

SSD SMART 是什麼?本文解析 SATA 與 NVMe SMART 差異,說明 Power On Hours、Temperature、Percentage Used、Available Spare 等常見健康參數,協助 Edge Storage 與工業設備掌握 SSD 健康狀態。

完整解析車用 SSD :AEC-Q100 IC 溫度等級(Grade 0~3)、IATF 16949、ISO/SAE 21434 資安與 PLP、pSLC 等子系統規格,並比較 eMMC/UFS/SSD 差異。威剛工業級提供車載、鐵道 NVR 與邊緣運算的寬溫儲存方案與選型支援。

NVMe SSDとは何か、NVMeとSATA SSDとの違い、そしてNVMeストレージが自動化、産業用システム、および高頻度データロギングに最適な理由について解説します。

ECC DRAMとは何か、エラー訂正の仕組み、そしてデータの整合性、システムの安定性、ネットワークセキュリティ、ミッションクリティカルなコンピューティングにおいて重要となる理由について解説します。

NVRストレージを選定する際の主な検討事項:HDD、SSD、監視用SSD、およびAI NVRのストレージ要件を比較し、安定した高性能監視システムを構築しましょう。

温度はすべてのSSDを左右する隠れた制限要因であり、SSDの温度範囲は性能仕様であると同時に信頼性仕様でもあります。持続的な負荷がかかると、NVMeファームウェアは複合温度を監視し、軽度または大幅なサーマルスロットリングを開始します。その結果、書き込みスループットが低下し、遅延は急上昇します。また、熱はNAND内部の電荷漏れを加速させ、保持期間の劣化を早めます。この影響は、プログラム/消去サイクルによってセルの劣化が進むほど悪化します。このため、耐久性の消耗が早まり、後にドライブが無通電状態で放置された際のデータ保持トラブルのリスクも高まります。