
Samsung was by far the biggest source of leading- and lagging-edge capacity at the end of 2022 according to Knometa Research's new Global Wafer Capacity 2023 report. Not only being the top supplier of DRAM and NAND flash memory products in the market, the company is also one of the biggest producers of advanced logic products, including SoCs for the fabless semiconductor sector and low-power, high-performance application processors for its own smartphones.
WD has released its highest capacity consumer drive with the 22TB (*) My Book desktop HDD, which is able to consolidate data from a variety of users’ storage devices into one organized and easy to access location. The company’s My Book Duo series is also available in a 44TB (*) capacity, equipped with RAID-optimized company drives that enables maximum speed and capacity. My Book Duo can be reconfigured to RAID-1 for redundancy (data mirroring) or used as 2 independent drives (JBOD) with the included software.


SK Hynix’s 2022 operating profit plunged 44% as its first operating loss in over ten years, despite revenue increasing by 4% compared to 2021. The loss result was compounded by lowered demand for memory chips and a significant drop in memory pricing, which also reflected the overall downward spiral of the PC industry during the second half of 2022. However, the company forecasts market conditions to gradually improve in the latter part of 2023 and expects to see a quick turnaround, with the world’s best technologies for DDR5 for data centers and 176-layer NAND flash-based enterprise SSD.
Micron is by far the biggest owner of offshore IC manufacturer capacity. The company operates 12 fabs outside of the US and accounts for 65% of the 2.6 million wafers produced overseas. Yet recently Micron announced that it will return to the US and build new fabs in Idaho and New York. However, Micron has also claimed to slow down its local capacity expansion as global memory business is weak, especially when the cost of memory mass-production in the US is much higher than that of its fabs in Taiwan, Japan and Singapore.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Medical devices are rapidly becoming more digital. From medical imaging systems, patient monitoring devices, endoscopy systems, and automated dispensing cabinets to healthcare edge gateways, an increasing number of healthcare applications must continuously record medical images, sensor data, operation logs, alarm events, and system status while supporting diagnostic and treatment workflows.

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NVR storage is not only about capacity planning. It also affects data integrity and long-term system reliability. For AI NVR and 24/7 recording environments, storage devices must handle heavy write workloads, RAID rebuilding, and continuous recording. As a result, choosing between HDD vs. SSD and selecting the right surveillance SSD have become critical for modern surveillance deployment.

Temperature is the silent limiter of every SSD, and the SSD temperature range is both a performance spec as well as a reliability spec. Under sustained load, NVMe firmware tracks a composite temperature and will start to throttle lightly or heavily. So, write throughput drops hard and latency spikes. Heat also speeds charge leakage inside NAND, which accelerates retention loss. The effect worsens as cells age from program/erase wear. Thus, you burn endurance faster and raise data-retention trouble when the drive later remains unpowered.

Garbage collection in SSDs is the controller's quiet cleanup job. It compacts still-valid pages into new space and erases blocks that are now mostly junk. That might sound weird until you remember NAND flash can't overwrite a programmed page. It must erase first, and erase happens at the block level, not per page. So, updates become "write elsewhere, then clean later."