
Samsung unveiled its updated fabrication technology roadmap at Samsung Foundry Forum (SFF) 2023
• The company is on track to produce chips on its 2nm and 1.4nm-class nodes in 2025 and 2027.
• Samsung intends to add a leading-edge 5nm-class radio frequency manufacturing process and start making gallium nitride (GaN) chips in the coming years.
• The strategic reallocation of resources between Kioxia and WDC could bolster the shipment volume of enterprise SSDs.
• WDC trims its capital investment in R&D team.
The company’s enterprise SSDs have lagged behind competitors with a notable decline in 2023 NAND flash profits, while its primary North American clients increasingly shift to in-house manufacturing.


SK Hynix begins mass production on 176-Layer to 238-Layer 4D NAND Flash.
• 238-layer process has 50% improvement on transfer speed (up to 2.4Gb/s) comparing to 176-layer, and 20% better RW speed.
• As the smallest NAND size, 238-layer has a 34% higher manufacturing efficiency compared to 176-layer.
• The company is planning to expand 238-layer technology across high-capacity server SSDs after adoption on smartphones.
The U.S. government is contemplating further restricting sales of AI processors to Chinese companies
The government is deliberating the possibility of imposing constraints on the lease of cloud services from giants including Micron and Amazon.


Q3 Global output is 9.4% lower than that of 3Q22, with a slight drop in quantity from 2Q23 numbers.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▂ |
| DDR4 | ● | ▂ | |
| DDR5 | ● | ▂ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▂ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

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