
Samsung developing memory chip density to extreme levels
• 11-nanometer DRAM and 9th Gen. V-NAND are both under development to meet the need of hyperscale AI devices, which requires high-performance, high-capacity, and low-power memory.
• The company is also mass producing HBM products to increase proportion of power AI,data center, and machine learning platforms revenue.
WD’s board of directors approved a plan to separate its HDD and flash businesses
• The separation will better position each franchise to execute innovative technology and product development, and capitalize on unique growth opportunities
Kioxia reported a record net loss of $1.3 billion in FY2Q23, reflecting the broader challenges in semiconductor demand
• Toshiba will be delisted from the Tokyo Stock Exchange on Dec.,20,2023, following Japan Industrial Partners’s $1.4M takeover.


SK hynix's market share of the DRAM market has reached 35% as of 3Q23
• Growth fueled by demand for AI chips, lifting demand for HBM products as well.
• The firm already accounted for 50% market share of HBM in Apr.’23, although this product line only represents 10% of DRAM revenue.
Micron announced its 32Gb monolithic die-based 128GB DDR5 RDIMM memory
• The product features performance of up to 8,000MT/s to support data center workloads today and into the future.
• Targeted mission-critical applications: AI, in-memory databases (IMDBs), processing for multithreaded, multicore count general compute workloads in data center and cloud environments.


| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Medical devices are rapidly becoming more digital. From medical imaging systems, patient monitoring devices, endoscopy systems, and automated dispensing cabinets to healthcare edge gateways, an increasing number of healthcare applications must continuously record medical images, sensor data, operation logs, alarm events, and system status while supporting diagnostic and treatment workflows.

Learn what an NVMe SSD is, how NVMe differs from SATA SSDs, and why NVMe storage is ideal for automation, industrial systems, and high-frequency data logging.

Learn what ECC DRAM is, how error correction works, and why it matters for data integrity, system stability, networking security, and mission-critical computing.

NVR storage is not only about capacity planning. It also affects data integrity and long-term system reliability. For AI NVR and 24/7 recording environments, storage devices must handle heavy write workloads, RAID rebuilding, and continuous recording. As a result, choosing between HDD vs. SSD and selecting the right surveillance SSD have become critical for modern surveillance deployment.

Temperature is the silent limiter of every SSD, and the SSD temperature range is both a performance spec as well as a reliability spec. Under sustained load, NVMe firmware tracks a composite temperature and will start to throttle lightly or heavily. So, write throughput drops hard and latency spikes. Heat also speeds charge leakage inside NAND, which accelerates retention loss. The effect worsens as cells age from program/erase wear. Thus, you burn endurance faster and raise data-retention trouble when the drive later remains unpowered.

Garbage collection in SSDs is the controller's quiet cleanup job. It compacts still-valid pages into new space and erases blocks that are now mostly junk. That might sound weird until you remember NAND flash can't overwrite a programmed page. It must erase first, and erase happens at the block level, not per page. So, updates become "write elsewhere, then clean later."