
Samsung develops next-gen cooling tech with Johns Hopkins
• Samsung has published a joint research paper titled “Nano-Engineered Thin-Film Thermoelectric Materials Enable Practical Solid-State Refrigeration” with the Johns Hopkins Applied Physics Laboratory (APL).The research team have achieved superior cooling efficiency by improving the efficiency of Peltier devices by nearly 75% through the use of new thin-film semiconductor materials as well as miniaturization and lightweight design.
Kioxia sampling upcoming CD9P series 2.5-Inch EDSFF/E3.S up to 61.44TB SSDs for data center
• The CD9P Series leverages Kioxia’s most advanced 3D flash memory to date (BiCS8), featuring a CBA-based architecture that reduces heat generation, enhances thermal management, and delivers greater overall value through improved performance, power metrics and total cost of ownership. The 15.36TB CD9P delivers approximately 60% and 45% improvements in sequential RW speeds/watt compared to the previous-gen SSD. It also achieves gains of approximately 55% and 100% in random RW performance per watt, measured in thousands of IOs (KIOs), respectively.


SK hynix, Micron push DDR4 last buys as phase-out boosts Q3 Prices
• DDR4 is experiencing the largest price hikes in the spot market, with modules surpassing chips in terms of price increases, a substantial portion of older processor platforms and device models still need DDR4 for memory support.
• Both SK hynix and Micron are actively negotiating last-time buy agreements with customers. The average spot price of mainstream chips (1Gx8 3,200MT/s) has increased by 22.2% in Jun. 2H.
Micron starts to ship samples of HBM4 memory to clients
• The new memory assemblies for next-generation AI and HPC processors feature a 36 GB capacity and offer bandwidth of 2 TB/s
• The 12-High devices feature data transfer rate of around 7.85 GT/s. The samples rely on 24GB DRAM devices made on the company's 1ß (1-beta) DRAM process technology as well as logic base dies produced by TSMC using its 12FFC+ (2nm-class) or N5 (5nm-class) logic process technology.

SSD is entering its seasonal demand lull. Influenced by North American inventory and China’s stern approach towards smuggling of imported memory products, Q3 flash shipments have dropped to the lowest level of 2025
Flash Sufficiency: maintain at low level since 2024.
Price Trend: NAND flash price had a slight bound in 2025/B and is expected to maintain at an average level throughout 2025 as chip makers’ plan of production cut continues, despite the general demand isn’t significantly strong and some inventory exist.
DRAM Sufficiency: almost maintain at extreme low level in 2025 except a slight expansion in Q1’25 to fulfill surging demand under price uptrend.
Price Trend: 8Gb spot price has risen sharply and is projected to exceed contract price in Q3’25 considering consistent production cut on DDR4.

Medical devices are rapidly becoming more digital. From medical imaging systems, patient monitoring devices, endoscopy systems, and automated dispensing cabinets to healthcare edge gateways, an increasing number of healthcare applications must continuously record medical images, sensor data, operation logs, alarm events, and system status while supporting diagnostic and treatment workflows.

Learn what an NVMe SSD is, how NVMe differs from SATA SSDs, and why NVMe storage is ideal for automation, industrial systems, and high-frequency data logging.

Learn what ECC DRAM is, how error correction works, and why it matters for data integrity, system stability, networking security, and mission-critical computing.

NVR storage is not only about capacity planning. It also affects data integrity and long-term system reliability. For AI NVR and 24/7 recording environments, storage devices must handle heavy write workloads, RAID rebuilding, and continuous recording. As a result, choosing between HDD vs. SSD and selecting the right surveillance SSD have become critical for modern surveillance deployment.

Temperature is the silent limiter of every SSD, and the SSD temperature range is both a performance spec as well as a reliability spec. Under sustained load, NVMe firmware tracks a composite temperature and will start to throttle lightly or heavily. So, write throughput drops hard and latency spikes. Heat also speeds charge leakage inside NAND, which accelerates retention loss. The effect worsens as cells age from program/erase wear. Thus, you burn endurance faster and raise data-retention trouble when the drive later remains unpowered.

Garbage collection in SSDs is the controller's quiet cleanup job. It compacts still-valid pages into new space and erases blocks that are now mostly junk. That might sound weird until you remember NAND flash can't overwrite a programmed page. It must erase first, and erase happens at the block level, not per page. So, updates become "write elsewhere, then clean later."