Micron on May 12 announced the industry's first 3D NAND memory device featuring 232 layers with a raw capacity of 1Tb (128GB). On May 25, Micron announced that it is planning to start volume production for its 1-beta nm process node in Taiwan next year, and Micron is planning to install extreme ultraviolet (EUV) lithography tools at its Taichung fab later this year. The CEO said it is in early preparation for its 1-gamma nm DRAM node volume production.
NAND Sufficiency: Shortage in 2Q22 is going to end and expect to recover in July.
Price Trend: SSD contract price is expected to remain at the same level.
|3D TLC (BiCS3)||●||▂|
|3D TLC (BiCS4)||●||
|3D TLC (BiCS5)||●||▂|
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
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