South Korea’s trucker strike has disrupted Samsung Electronics‘ chip production in China. The Korea International Trade Association (Kita) said a Korean company that produces isopropyl alcohol (IPA), a raw material for cleaning chip wafers, is facing complications in shipping to a Chinese company that in turn supplies wafers to chip manufacturers. Kita said in a statement that about 90 tonnes, or a week’s worth of shipments have been delayed.
KIOXIA announced sampling of the industry’s first XFM DEVICE ver. 1.0 compliant removable PCIe® attached, NVMe™ storage device in 256 GB and 512 GB models. With a new form factor and connector in small size to meet the specification of the JEDEC standard, the XFM DEVICE ver. 1.0 standard is designed to enhance next-generation mobile PCs, IoT devices and various embedded applications.
China approves SK Hynix's acquisition of Key Foundry. It has been about eight months since SK Hynix officially announced its plan to acquire Key Foundry. If SK Hynix embraces Key Foundry, it will leap forward to become the second-largest foundry in South Korea after Samsung Electronics. Production capacity is likely to nearly double compared to before. There is a high chance that SK Hynix will rank in the top 10 in the global foundry market.
Micron Technology, a major vendor of memory chips for PCs and smartphones, said on 30th of June that it now expects smartphone sales to be meaningfully lower than previously expected for the rest of 2022. The company said that consumer demand is slowing because of China lockdowns, the Russia-Ukraine war, and rising inflation.
NAND Sufficiency: Expected to be oversupply globally until end of 2022 due to regional conflicts and global inflation.
Price Trend: SSD contract price is expected to slightly decrease in July.
DRAM Sufficiency: Global demand is weaker, so a slight oversupply is expected to last until end of 2022.
Price Trend: Contract prices are expected to decrease slightly and will be close to the spot prices.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module  |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage  |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend
Ⓒ 2024 ADATA Technology Co., Ltd. All Rights Reserved.
