
On October 18, Samsung Electronics announced that its latest LPDDR5X DRAM with the industry’s fastest speed of 8.5Gbps was validated for use on Snapdragon® mobile platforms. Samsung has surpassed the previous maximum speed of 7.5Gbps achieved in March, reaffirming its leadership in the memory market. LPDDR DRAM is expected to also extend its presence in emerging markets driven by artificial intelligence (AI) and the metaverse.
KIOXIA Corp. and Western Digital Corp. celebrated the opening of Fab7, at the Yokkaichi Plant in Mie Prefecture, Japan. Production capacity at Fab7 will ramp up in stages over time, in line with market trends. Total investment in phase one of Fab7 is expected to be approximately ¥1 trillion. Fab7 has the capability to produce sixth-generation, 162-layer flash memory and future advanced 3D flash memory, is scheduled to start shipping 162-layer flash memory in early 2023.


SK Hynix Introduced World’s First 32 GB DDR5-6400 SODIMM & UDIMM Memory Module on Oct 25. The DDR5 6,400 Mbps module product developed by SK Hynix is the current fastest DDR5 product for PC/Client. A new device called CKD (Clock Driver) is applied for more stable operation when processing high-speed data over 6,400 Mbps.
TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. According to TSMC, 19 members have joined the 3DFabric Alliance, including Micron Technology, Samsung Memory, SK Hynix, ASE, Siliconware, Amkor, Ibiden and Unimicron.

Except PC DRAM, global output keeps growing gradually in a low growth rate because of the weak demand.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
| 3D TLC (BiCS3) | ● | ▂ | |
| 3D TLC (BiCS4) | ● | ▼ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

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