With electronic components such as PCB and NAND Flash becoming ever more compact and refined, solder joints are becoming smaller as well. However, smaller solder joints are more susceptible to thermal expansion and contraction or external forces that may cause PCB bending, and as a result, peel off more easily and lose conductivity.
Side Fill is a technology that remedies this problem. It works by filling the BGA IC peripheral with UV glue. This results in solder joints that are more resilient against the effects of temperature and external forces, thus preventing PCB bending. As a result, SSDs operating in harsher environments can enjoy extended lifespans.
Products featuring Side Fill technology can counter the effects of temperature and impact, and ensure optimal operation in environments with the presence of vibrations and extreme temperatures.