
Samsung speeds up in-house CPU Core development with ex-AMD engineer hired
Samsung is aiming to use its own CPU cores for both smartphones and laptops, probably only be rolling out by 2027, and it will drop the “Exynos” branding instead calling them “Galaxy Chip(s)”.
WD Kioxia and Western Digital have revealed their jointly developed 8th Generation BiCs 3D NAND memory device featuring 218 active layers.
The 2 companies are the first 3D NAND makers in the world to unveil a flash memory IC with a 3200 MT/s I/O, leapfrogging competitors by 33%.


SK Hynix recently published details about its 8th Gen 3D NAND memory device with over 300 active layers.
The doubled bit density is expected to increase the per-wafer productivity of the new manufacturing node when it arrives sometime in the 2024-25 timeframe.
· Micron’s DRAM revenue fell by 41.2%, recording the largest revenue decline among suppliers
· Micron’s DRAM capacity utilization rate has fallen to 84% and is expected to stay at this level through 2023
· Micron has begun mass production with its latest
1beta nm process. Its operation in Taiwan will also deploy this process with wafer input scheduled for the middle of 2023, mass production taking place during 2H23.

Global output falls to a new low compared to 2022, while PC DRAM production is recovered slightly.
| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▼ |
| DDR4 | ● | ▼ | |
| DDR5 | ● | ▼ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▂ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▂ | |
| 3D TLC (BiCS4) | ● | ▂ | |
| 3D TLC (BiCS5) | ● | ▼ |
● Smooth supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

Medical devices are rapidly becoming more digital. From medical imaging systems, patient monitoring devices, endoscopy systems, and automated dispensing cabinets to healthcare edge gateways, an increasing number of healthcare applications must continuously record medical images, sensor data, operation logs, alarm events, and system status while supporting diagnostic and treatment workflows.

Learn what an NVMe SSD is, how NVMe differs from SATA SSDs, and why NVMe storage is ideal for automation, industrial systems, and high-frequency data logging.

Learn what ECC DRAM is, how error correction works, and why it matters for data integrity, system stability, networking security, and mission-critical computing.

NVR storage is not only about capacity planning. It also affects data integrity and long-term system reliability. For AI NVR and 24/7 recording environments, storage devices must handle heavy write workloads, RAID rebuilding, and continuous recording. As a result, choosing between HDD vs. SSD and selecting the right surveillance SSD have become critical for modern surveillance deployment.

Temperature is the silent limiter of every SSD, and the SSD temperature range is both a performance spec as well as a reliability spec. Under sustained load, NVMe firmware tracks a composite temperature and will start to throttle lightly or heavily. So, write throughput drops hard and latency spikes. Heat also speeds charge leakage inside NAND, which accelerates retention loss. The effect worsens as cells age from program/erase wear. Thus, you burn endurance faster and raise data-retention trouble when the drive later remains unpowered.

Garbage collection in SSDs is the controller's quiet cleanup job. It compacts still-valid pages into new space and erases blocks that are now mostly junk. That might sound weird until you remember NAND flash can't overwrite a programmed page. It must erase first, and erase happens at the block level, not per page. So, updates become "write elsewhere, then clean later."