
Samsung maintains production cuts despite rising NAND flash prices
• Samsung is carefully managing supply by instituting a 50% reduction in production to avoid any potential negative impact on NAND profitability.
• The prevailing view holds that the recent uptick in NAND flash prices is attributed more to supply constraints than to an actual surge in demand.
Kioxia offers SK hynix chip making access in Japan
• The firm is giving Hynix the opportunity to produce semiconductors at its Japanese location in a bid to revive its merger talks with Western Digital.
Kioxia and WD JV to receive up to USD 1 billion government subsidy.
The subsidy will be invested in JV’s Japanese facility that will produce its latest generation of 3D flash memory based on the innovative wafer bonding technology and future generation of advanced nodes.

Micron's 24GB HBM3E chips to power Nvidia's next-gen AI GPUs
• HBM3E is the latest ultra-fast memory from Micron designed for datacenter and AI-class CPUs, e.g. Nvidia’s H200 that is expected to be launched in Q2’24 with six HBM3E memory chips.
• Micron is the first firm to announce HBM3E volume production, with bandwidth improvement from the 1TB/s of HBM3 to 1.2TB/s. The firm is also planning HBM3E 36GB chips that is said to have even higher bandwidth and more power efficiency then the 24GB.


after peak shipment in 4Q23, WW SSD demand is expected to grow stably throughout 2024.

| Type | Supply | Price | |
|---|---|---|---|
|
DRAM Module ![]() |
DDR3 | ● | ▲ |
| DDR4 | ● | ▲ | |
| DDR5 | ● | ▲ | |
|
Flash Storage ![]() |
SLC | ● | ▂ |
| MLC | ● | ▲ | |
|
3D TLC (BiCS3) *Limited Supply. We encourage you to migrate to BiCS4 and BiCS5 |
● | ▲ | |
| 3D TLC (BiCS4) | ● | ▲ | |
| 3D TLC (BiCS5) | ● | ▲ |
●Smooth Supply ● Mildly Tight Supply ● Tight supply ▂ Flat ▲ Upward trend ▼ Downward trend

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